Stacked complementary field effect transistor (CFET) and method of manufacture
A stacked gate-all-around (GAA) complementary field-effect transistor (CFET) includes a first GAA FET of a first type and a second GAA FET of a second type. Each of the first GAA FET and the second GAA FET includes at least one three-dimensional (3D) semiconductor slab with a channel region and a first surface. A first gate structure surrounds the channel region in the first GAA FET, and a second gate structure surrounds the channel region in the second GAA FET. The first gate structure is stacked opposite the second gate structure in a direction orthogonal to the first surface. In some examples, a first crystal structure of the 3D semiconductor slab in the first GAA FET has a first orientation, and a second crystal structure of the 3D semiconductor slab in the second GAA FET has a different orientation for improved carrier mobility.
1 . A stacked complementary field-effect transistor (CFET) comprising:
a first gate-all-around (GAA) FET of a first type, the first GAA FET comprising:
a first channel region comprising a first crystal structure comprising a first orientation; and
a first gate structure surrounding the first channel region; and
a second GAA FET of a second type, the second GAA FET comprising:
a second channel region comprising a second crystal structure comprising a second orientation different than the first orientation; and
a second gate structure surrounding the second channel region.
2 . The stacked CFET of claim 1 , wherein:
the first orientation of the first crystal structure comprises a surface orientation of (100); and
the second orientation of the second crystal structure comprises a surface orientation of (110).
3 . The stacked CFET of claim 1 , wherein:
the first GAA FET of the first type is an N-type FET; and
the second GAA FET of the second type is a P-type FET.
4 . The stacked CFET of claim 1 , further comprising:
a first layer comprising the first GAA FET;
a second layer comprising the second GAA FET; and
a third layer between the second layer and the first layer,
wherein:
the first channel region extends in a first direction and in a second direction orthogonal to the first direction.
5 . The stacked CFET of claim 4 , wherein the third layer comprises a bonding layer bonding the first layer to the second layer.
6 . The stacked CFET of claim 5 , wherein the bonding layer comprises an oxide layer.
7 . The stacked CFET of claim 4 , wherein the third layer comprises a semiconductor substrate.
8 . The stacked CFET of claim 4 , further comprising a via extending through the third layer from the first gate structure to the second gate structure,
wherein:
the via extends in a third direction orthogonal to the first direction and the second direction directly between the first channel region and the second channel region.
9 . The stacked CFET of claim 4 , further comprising:
a first dielectric layer on the first layer, the first dielectric layer comprising a first contact coupled to the first GAA FET; and
a second dielectric layer on the second layer, the second dielectric layer comprising a second contact coupled to the second GAA FET.
10 . The stacked CFET of claim 9 , further comprising:
a via extending from the first contact to the second contact through the first layer, the third layer, and the second layer.
11 . The stacked CFET of claim 9 , further comprising a first semiconductor substrate between the first layer and the first dielectric layer.
12 . The stacked CFET of claim 11 , further comprising a second semiconductor substrate between the second layer and the second dielectric layer.
13 . The stacked CFET of claim 1 , wherein a first epitaxial region coupled to the first channel region of the first GAA FET is coupled to a second epitaxial region coupled to the second channel region of the second GAA FET.
14 . The stacked CFET of claim 1 integrated into an integrated circuit (IC).
15 . The stacked CFET of claim 1 integrated into a device selected from the group consisting of: a set-top box; an entertainment unit; a navigation device; a communications device; a fixed location data unit; a mobile location data unit; a global positioning system (GPS) device; a mobile phone; a cellular phone; a smartphone; a session initiation protocol (SIP) phone; a tablet; a phablet; a server; a computer; a portable computer; a mobile computing device; a wearable computing device; a desktop computer; a personal digital assistant (PDA); a monitor; a computer monitor; a television; a tuner; a radio; a satellite radio; a music player; a digital music player; a portable music player; a digital video player; a video player; a digital video disc (DVD) player; a portable digital video player; an automobile; a vehicle component; avionics systems; a drone; and a multicopter.
16 . A method of making a stacked complementary field-effect transistor (CFET), the method comprising:
forming a first gate-all-around (GAA) FET of a first type, the first GAA FET comprising:
a first channel region comprising a first crystal structure comprising a first orientation; and
a first gate structure surrounding the first channel region;
forming a second GAA FET of a second type, the second GAA FET comprising:
a second channel region comprising a second crystal structure comprising a second orientation different than the first orientation; and
a second gate structure surrounding the second channel region.
17 . The method of claim 16 , wherein:
forming the first GAA FET further comprises forming the first GAA FET in a first layer on a first oxide layer on a first substrate; and
forming the second GAA FET further comprises forming the second GAA FET in a second layer on a second oxide layer on a second substrate,
wherein:
the first channel region extends in a first direction and in a second direction orthogonal to the first direction.
18 . The method of claim 16 , wherein:
the first orientation comprises a surface orientation of (100) orientation; and
the second orientation comprises a surface orientation of (110) orientation.
19 . The method of claim 17 , further comprising:
forming a bonding layer on one of the first layer and the second layer; and
stacking the second layer on the first layer.
20 . The method of claim 19 , further comprising:
forming a via extending through the bonding layer coupling the first gate structure to the second gate structure.