Selective etching of silicon-containing material relative to metal-doped boron films
Exemplary semiconductor processing methods may include depositing a metal-doped boron-containing material on a substrate disposed within a processing region of a semiconductor processing chamber. The metal-doped boron-containing material may include a metal dopant comprising tungsten. The substrate may include a silicon-containing material. The methods may include depositing one or more additional materials over the metal-doped boron-containing material. The one or more additional materials may include a patterned photoresist material. The methods may include transferring a pattern from the patterned photoresist material to the metal-doped boron-containing material. The methods may include etching the metal-doped boron-containing material with a chlorine-containing precursor. The methods may include etching the silicon-containing material with a fluorine-containing precursor. The metal dopant may enhance an etch rate of the silicon-containing material. The methods may include removing the metal-doped boron-containing material from the substrate with a halogen-containing precursor.
1 . A semiconductor processing method comprising:
depositing a metal-doped boron-containing material on a substrate disposed within a processing region of a semiconductor processing chamber, wherein the metal-doped boron-containing material comprises a metal dopant comprising tungsten, and wherein the substrate comprises a silicon-containing material;
depositing one or more additional materials over the metal-doped boron-containing material, wherein the one or more additional materials comprise a patterned photoresist material;
transferring a pattern from the patterned photoresist material to the metal-doped boron-containing material;
etching the metal-doped boron-containing material with a chlorine-containing precursor;
etching the silicon-containing material with a fluorine-containing precursor, wherein the metal dopant enhances an etch rate of the silicon-containing material; and
removing the metal-doped boron-containing material from the substrate with a halogen-containing precursor.
2 . The semiconductor processing method of claim 1 , wherein a metal dopant concentration within the metal-doped boron-containing material is maintained at less than or about 80 at. %.
3 . The semiconductor processing method of claim 1 , wherein the one or more additional materials comprise:
an oxide hardmask deposited over the metal-doped boron-containing material;
a carbon hardmask deposited over the oxide hardmask; and
one or more anti-reflective coatings deposited over the carbon hardmask, wherein the patterned photoresist material overlies the one or more anti-reflective coatings.
4 . The semiconductor processing method of claim 1 , wherein the chlorine-containing precursor comprises diatomic chlorine (Cl 2 ).
5 . The semiconductor processing method of claim 1 , further comprising:
during etching of the metal-doped boron-containing material, applying a plasma power to the processing region.
6 . The semiconductor processing method of claim 1 , further comprising:
during etching of the metal-doped boron-containing material, intermittently delivering a silicon-containing precursor and an oxygen-containing precursor to form a passivation material on sidewalls of the metal-doped boron-containing material.
7 . The semiconductor processing method of claim 6 , wherein:
the silicon-containing precursor comprises silicon tetrachloride (SiCl 4 ); or
the oxygen-containing precursor comprises molecular oxygen (O 2 ).
8 . The semiconductor processing method of claim 1 , wherein the fluorine-containing precursor comprises a fluorocarbon.
9 . The semiconductor processing method of claim 1 , wherein the metal dopant facilitates fluorine radical formation during etching of the silicon-containing material.
10 . The semiconductor processing method of claim 1 , wherein the halogen-containing precursor comprises diatomic chlorine (Cl 2 ) or hydrogen bromide (HBr).
11 . A semiconductor processing method comprising:
depositing a metal-doped boron-containing material over a silicon-containing material overlying a substrate disposed within a processing region of a semiconductor processing chamber, wherein the metal-doped boron-containing material comprises a metal;
delivering a fluorine-containing precursor and an oxygen-containing precursor to the processing region of the semiconductor processing chamber;
forming a plasma of the fluorine-containing precursor and the oxygen-containing precursor within the processing region of the semiconductor processing chamber; and
etching the silicon-containing material, wherein the etching removes a portion of the metal-doped boron-containing material, and wherein the metal increases an etch rate of the silicon-containing material.
12 . The semiconductor processing method of claim 11 , wherein the metal-doped boron-containing material further comprises one or more of tungsten, molybdenum, titanium, aluminum, cobalt, ruthenium, tantalum, hafnium, zirconium, silicon, carbon, or nitrogen.
13 . The semiconductor processing method of claim 11 , wherein the metal-doped boron-containing material further comprises tungsten.
14 . The semiconductor processing method of claim 11 , further comprising:
depositing a photoresist material over the metal-doped boron-containing material;
patterning the photoresist material; and
transferring a pattern from the patterned photoresist material to the metal-doped boron-containing material.
15 . The semiconductor processing method of claim 11 , wherein the fluorine-containing precursor comprises a fluorocarbon, and wherein the fluorine-containing precursor passivates sidewalls of the metal-doped boron-containing material.