Active silicon D2D bridge
A microelectronic system may include a substrate having a first surface, one or more interposers mounted to and electrically connected to the first surface, first and second application specific integrated circuits (ASICs) each at least partially overlying and electrically connected to one of the interposers, a plurality of high-bandwidth memory elements (HBMs) each at least partially overlying and electrically connected to one of the interposers, and an active silicon bridge mounted to and electrically connected to the first surface and providing an electrical connection between the first and second ASICs, the active silicon bridge having active microelectronic devices therein. The microelectronic system may be configured such that the first and second ASICs and the active silicon bridge each have a purely digital CMOS interface therein. A plurality of bumps providing the electrical connection between the ASICs and the active silicon bridge may be configured to receive serial data therethrough.
1 . A microelectronic system, comprising:
a substrate having a first surface;
one or more interposers mounted to and electrically connected to the first surface, each of the one or more interposers having electrically conductive vias extending therethrough;
first and second application specific integrated circuits (ASICs) each at least partially overlying and electrically connected to one of the interposers;
a plurality of high-bandwidth memory elements (HBMs) each at least partially overlying and electrically connected to one of the interposers;
an active silicon bridge mounted to and electrically connected to the first surface and providing an electrical connection between the first and second ASICs, the active silicon bridge having active microelectronic devices therein,
wherein the microelectronic system is configured such that the first and second ASICs and the active silicon bridge each have a parallel interface therein, and a plurality of bumps providing the electrical connection between the ASICs and the active silicon bridge are configured to receive serial data therethrough such that the electrical connection between the ASICs and the active silicon bridge has a channel length that is substantially equal to the thickness of the bumps.
2 . The microelectronic system of claim 1 , wherein the active silicon bridge has a plurality of parallel connections therein extending between a first plurality of flip-flops and a second plurality of flip-flops.
3 . The microelectronic system of claim 2 , wherein the parallel connections are configured to have a bandwidth of 2 Gbps per lane.
4 . The microelectronic system of claim 1 , wherein the first and second ASICs and the active silicon bridge each include a serializer and a de-serializer.
5 . The microelectronic system of claim 4 , wherein each serializer is 16:1 and each de-serializer is 1:16, such that the bumps are configured to have a serial data rate of 32 Gbps through the bumps, which is configured to be converted to a parallel interface of 2 Gbps within the first and second ASICs and within the active silicon bridge.
6 . The microelectronic system of claim 1 , further comprising a serializer/de-serializer element at least partially overlying and electrically connected to one of the interposers.
7 . The microelectronic system of claim 1 , further comprising a peripheral component interconnect express element at least partially overlying and electrically connected to one of the interposers.
8 . The microelectronic system of claim 1 , wherein the active silicon bridge has an HBM controller functionality that is configured to control operation of the HBMs.
9 . The microelectronic system of claim 1 , wherein the active silicon bridge has a repeater functionality that is configured to repeat electrical signals within the active silicon bridge.
10 . The microelectronic system of claim 1 , wherein the active silicon bridge is a first active silicon bridge, the microelectronic system further comprising a second active silicon bridge mounted to and electrically connected to the first surface and providing an electrical connection between the first and second ASICs, the second active silicon bridge having active microelectronic devices therein.
11 . The microelectronic system of claim 1 , further comprising a deep trench capacitor mounted to and electrically connected to the first surface, the deep trench capacitor being electrically connected to at least one of the first and second ASICs.