IP Library › Granted Patent US 12,575,136
Granted Patent B2
US 12,575,136 · App. 18/158,176 · Granted Mar 10, 2026

Transistor

Inventors: Sangwook Kim (Suwon-si, KR); Kyung-Eun Byun (Suwon-si, KR); Keunwook Shin (Suwon-si, KR); Moonil Jung (Suwon-si, KR); Euntae Kim (Suwon-si, KR); Jeeeun Yang (Suwon-si, KR); Kwanghee Lee (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H10D30/6755H10D30/6729H10D62/882
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Quick Facts
Patent No.
US 12,575,136
App. No.
18/158,176
Filed
Jan 23, 2023
Granted
Mar 10, 2026
Kind
B2
Art Unit
2898
USPC
257/288
Abstract

A transistor includes an oxide semiconductor layer, a source electrode and a drain electrode disposed spaced apart from each other on the oxide semiconductor layer, a gate electrode spaced apart from the oxide semiconductor layer, a gate insulating layer disposed between the oxide semiconductor layer and the gate electrode, and a graphene layer disposed between the gate electrode and the gate insulating layer and doped with a metal.

Claims (28)

1 . A transistor comprising:

an oxide semiconductor layer;

a source electrode and a drain electrode spaced apart from each other on the oxide semiconductor layer;

a gate electrode spaced apart from the oxide semiconductor layer;

a gate insulating layer between the oxide semiconductor layer and the gate electrode; and

a graphene layer between the gate electrode and the gate insulating layer and doped with a metal.

2 . The transistor of claim 1 , wherein the metal doped in the graphene layer is different from a metal included in the oxide semiconductor layer.

3 . The transistor of claim 1 , wherein the metal doped into the graphene layer includes at least one of ruthenium (Ru), aluminum (Al), titanium (Ti), platinum (Pt), thallium (Tl), tantalum (Ta), rhodium (Rh), iridium (Ir), cobalt (Co), and tungsten (W).

4 . The transistor of claim 1 , wherein the metal is doped into the graphene layer in an amount of 0.2 at % or more and 5 at % or less with respect to a total amount of the graphene layer.

5 . The transistor of claim 1 , wherein a work function of the graphene layer is greater or equal to 4.9 eV or and less than or equal to 5.1 eV.

6 . The transistor of claim 1 , wherein a threshold voltage of the transistor is positive when a current flowing from the drain electrode to the source electrode is about 10 −12 A/micron.

7 . The transistor of claim 1 , wherein a thickness of the graphene layer is less than a thickness of the gate electrode.

8 . The transistor of claim 1 , wherein a thickness of the graphene layer is less than or equal to 10 nm.

9 . The transistor of claim 1 , wherein the graphene layer is in contact with two or more surfaces of the gate electrode.

10 . The transistor of claim 1 , wherein the graphene layer is in contact with a lower surface of the gate electrode and a side surface of the gate electrode.

11 . The transistor of claim 1 , wherein the gate insulating layer at least partially covers two or more surfaces of the gate electrode.

12 . The transistor of claim 1 , wherein the gate insulating layer at least partially covers a lower surface of the gate electrode and a side surface of the gate electrode.

13 . The transistor of claim 1 , wherein the gate insulating layer is in contact with at least one of the source electrode and the drain electrode.

14 . The transistor of claim 1 , wherein at least one of the source electrode and the drain electrode includes a stepped shape.

15 . The transistor of claim 1 , wherein at least one of the source electrode and the drain electrode includes a first region having a first thickness and a second region having a second thickness less than the first thickness, and the second region is closer to the gate electrode than the first region.

16 . The transistor of claim 1 , wherein the source electrode, the drain electrode, and the gate insulating layer are in contact with a same surface of the oxide semiconductor layer.

17 . The transistor of claim 1 , wherein the source electrode and the drain electrode are on a first surface of the oxide semiconductor layer, and the gate insulating layer is on a second surface, different from the first surface of the oxide semiconductor layer.

18 . The transistor of claim 1 , wherein

the gate insulating layer includes a first gate insulating layer in contact with a first surface of the oxide semiconductor layer and a second gate insulating layer in contact with a second surface different from the first surface of the oxide semiconductor layer,

the gate electrode includes a first gate electrode on the first gate insulating layer and a second gate electrode on the second gate insulating layer, and

the graphene layer includes a first graphene layer between the first gate insulating layer and the first gate electrode and a second graphene layer between the second gate insulating layer and the second gate electrode.

19 . The transistor of claim 1 , wherein the source electrode, the oxide semiconductor layer, and the drain electrode are sequentially arranged in one direction.

20 . The transistor of claim 1 , wherein the gate insulating layer entirely surrounds a side surface of the oxide semiconductor layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2023
From: KIM, SANGWOOK; BYUN, KYUNG-EUN; SHIN, KEUNWOOK; JUNG, MOONIL; KIM, EUNTAE; YANG, JEEEUN; LEE, KWANGHEE
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 062505/0015 →
Priority Claims (1)
KR 10-2022-0012580 · Jan 27, 2022 · national
Continuity (1)
Related Publication 20230238460A1 · Jul 27, 2023
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