Method for machining a workpiece
The present invention relates to a method for machining a workpiece, comprising the steps of introducing a plurality of adjacent modifications into the material of the workpiece by means of laser radiation, etching the material of the workpiece in a first etching operation with a first selectivity, in order to remove predominantly the material modified by the laser radiation, and, after completion of the first etching operation, etching the material of the workpiece in a second etching operation with a second selectivity, different from the first selectivity, in order to remove the webs left between the removed modified material.
1 . A method for machining a workpiece, the method comprising:
introducing a plurality of adjacent modifications into a material of the workpiece by laser radiation, the plurality of adjacent modifications being distributed over a volume of the material of the workpiece,
etching the material of the workpiece in a first etching operation with a first selectivity, in order to remove predominantly the material modified by the laser radiation, and
after completion of the first etching operation, etching the material of the workpiece in a second etching operation with a second selectivity different from the first selectivity, in order to remove webs left in the volume between the removed modified material,
wherein at least some of the plurality of adjacent modifications introduced into the material of the workpiece have different lengths in a direction of propagation of the laser radiation so that, after completion of the first etching operation, a plurality of adjacent blind holes are created, and after completion of the second etching operation, the webs left between the adjacent blind holes are removed.
2 . The method as claimed in claim 1 , wherein the first etching operation and the second etching operation differ by chemical composition, a temperature and/or a concentration of etching solutions and/or by ultrasonic power introduced in an ultrasonic bath.
3 . The method as claimed in claim 1 , wherein the first selectivity and the second selectivity differ by at least a factor of 2.
4 . The method as claimed in claim 1 , wherein the first selectivity is greater than the second selectivity.
5 . The method as claimed in claim 1 , wherein, after completion of the second etching operation, one or more further etching operations take place, each with a different selectivity.
6 . The method as claimed in claim 1 , wherein the material of the workpiece is transparent to a wavelength of the laser radiation.
7 . The method as claimed in claim 1 , wherein the modifications are introduced into the material of the workpiece by ultrashort laser pulses.
8 . The workpiece with a plurality of drawn-out holes, wherein each of the plurality of drawn-out holes is produced by a method as claimed in claim 1 .
9 . A method for machining a workpiece, the method comprising:
introducing a plurality of adjacent modifications into a material of the workpiece by laser radiation, the plurality of adjacent modifications being distributed over a volume of the material of the workpiece,
etching the material of the workpiece in a first etching operation with a first selectivity, in order to remove predominantly the material modified by the laser radiation, and
after completion of the first etching operation, etching the material of the workpiece in a second etching operation with a second selectivity different from the first selectivity, in order to remove webs left in the volume between the removed modified material,
wherein at least some of the plurality of adjacent modifications introduced into the material of the workpiece have different lengths in a direction of propagation of the laser radiation so that, after completion of the second etching operation, an hourglass-shaped through hole is formed in the workpiece.