Hybrid computer module element X-(cross)-point memory
View Patent ↗Hybrid computer module element X-(Cross)-point memory.
1 . A server including a hybrid computing module effective to operate at frequency within Terahertz (THz) frequency domain and comprising an intrinsic clock and configured to received applied signals, a processor for converting voltage, wherein the hybrid computing module comprises, a semiconductor embedded within a high speed semiconductor embedded within a high speed semiconductor chip stack of dies or semiconductor carrier with one or more separate items of the following:
at least one hybrid computing module that is constructed to operate at a clock speed that optimally matches the intrinsic clock speed of said semiconductor die embedded within the high speed semiconductor chip stack or semiconductor die mounted upon the semiconductor carrier with at least one chip or die that has circuit elements surface bonded to it,
wherein at least one semiconductor embedded within the high-speed semiconductor chip stack or semiconductor die mounted upon the semiconductor carrier is a resistive element X-Point (Cross-Point) memory device, and
wherein said passive circuit comprises electroceramic dielectric members having a polarization response time determined solely by orbital deformations within and operates in phase, thus does not distort, any of the applied signal components forming a high-speed digital pulse operating at clock speeds that run within Terahertz (THz) frequency domain.
2 . The server of claim 1 ,
wherein the hybrid computer module further comprises,
one or more high-speed semiconductor chip stacks bonded to the surface of said semiconductor carrier in which at least one passive circuit element, preferably all passive circuit elements, consists of electroceramic dielectric members that maintain critical performance tolerances.
3 . The server as in claim 2 , wherein,
the electroceramic dielectric members have high dielectric density producing a relative permittivity (ER) in excess of ε.sub.R.=40, preferably in excess of ε.sub.R.=200.
4 . The server as in claim 3 , wherein,
the electroceramic dielectric members have high dielectric density producing a relative permeability (μ.sub.R) in excess of μ.sub.R.=10, preferably in excess of μ.sub.R.=100.
5 . The server as in claim 1 , wherein,
the server comprises a hybrid computing module or high speed semiconductor chip stack including a sensor and a harness of a server rack that is in electrical communication with a power management device of the sensor that further comprises a resonant gate transistor used as a power switch.
6 . The server as in claim 5 , wherein,
the power management device is formed or mounted on the semiconductor carrier.
7 . The server as in claim 5 , wherein,
the power management device is mounted within the harness of a server rack.
8 . The server as in claim 5 , wherein
a power management device, preferably a power management device comprising a resonant gate transistor, converts the voltage from a resistive memory element located at a single address location on a X-Point (Cross Point) memory device system into a bit pulse.
9 . The server as in claim 5 , wherein,
said power management device, preferably a power management device comprising a resonant gate transistor, simultaneously converts a plurality of read voltages from a plurality or string of resistive memory element address locations within a X-Point (Cross Point) memory system or device into a string of pulsed bits or a bit string.
10 . The server as in claim 9 , wherein,
the string of pulsed bits, or bit string, is produced simultaneously during a single processor clock cycle.
11 . The server as in claim 9 , wherein,
bit string is interpreted as a word or a plurality of words.
12 . The server as in claim 11 , wherein,
the word or plurality of words are simultaneously input or output to the processor during a single clock cycle through a plurality of independent and simultaneously operating bus interfaces managing data traffic between memory systems/devices and processor(s),
wherein the simultaneous bus interfaces include, but are not limited to: one or more data stack buses, one or more return stack buses, one or more register buses, and, one or more program memory buses.
13 . The server as in claim 9 , wherein,
a single resistive memory element is used to store a plurality of addressable memory states from a single memory address, and a state of a single resistive element from the string resistive memory element address locations within a X-Point (Cross Point) memory system or device is used to store a data byte or a word.
14 . The server in claim 13 , wherein
said power management device, preferably the power management device comprising a resonant gate transistor, converts the read voltage from a resistive memory element located at a single address location on a X-Point (Cross Point) memory system or device into a bit string that faithfully represents the data byte or word.