Bottom contact jumpers for stacked field effect transistor semiconductors
Embodiments are disclosed for a semiconductor structure. The semiconductor structure includes a stacked field effect transistor (FET) including a top FET and a bottom FET. Additionally, the semiconductor structure includes a bottom source/drain (S/D) contact jumper connection within a gate cut region. The gate cut includes a liner spacer and a dielectric fill within the first liner spacer. Additionally, the bottom S/D contact jumper is within the dielectric fill. The semiconductor structure further includes a top S/D contact fly-over over a bottom S/D contact in contact with the bottom S/D contact jumper. Additionally, the semiconductor structure includes a top S/D access metal track over the bottom S/D contact, through the top S/D contact. Further, the semiconductor structure includes a recessed gate cut liner facing the top S/D contact fly-over. Additionally, the semiconductor structure includes a non-recessed gate cut liner facing a non-fly-over top S/D contact.
1 . A semiconductor structure comprising:
a stacked field effect transistor (FET) comprising a top FET and a bottom FET;
a bottom source/drain (S/D) contact jumper connection disposed within a gate cut region, wherein the gate cut region comprises a first liner spacer and a dielectric fill disposed within the first liner spacer, and wherein the bottom S/D contact jumper is formed within the dielectric fill;
a top S/D contact fly-over disposed over a bottom S/D contact in contact with the bottom S/D contact jumper;
a top S/D access metal track disposed over the bottom S/D contact through the top S/D contact;
a first gate cut liner facing the top S/D contact fly-over, wherein the first gate cut liner is recessed; and
a second gate cut liner facing a non-fly-over top S/D contact, wherein the second gate cut liner is not recessed.
2 . The semiconductor structure of claim 1 , further comprising a single height cell comprising the stacked FET, wherein the top S/D contact fly-over connects a first source of a top FET of the stacked FET, using the bottom S/D contact jumper, to:
a drain of the stacked FET; and
a second source of a second device.
3 . The semiconductor structure of claim 1 , further comprising a double height cell comprising the stacked FET, wherein the top S/D contact fly-over connects a first source of a bottom FET of the stacked FET, using the bottom S/D contact jumper, to a second drain of a top FET of a second stacked FET.
4 . The semiconductor structure of claim 1 , wherein the top S/D contact fly-over connects the bottom contact jumper of a first cell of the semiconductor structure to a bottom contact jumper of a second cell disposed in a same device layer of the first cell.
5 . The semiconductor structure of claim 1 , wherein the top S/D contact fly-over connects the bottom contact jumper of a first cell of the semiconductor structure to a bottom contact jumper of a second cell disposed in a different device layer from the first cell.
6 . The semiconductor structure of claim 1 , wherein the contact fly-over is disposed over, and in contact with, a top S/D epitaxial of the stacked FET.
7 . The semiconductor structure of claim 1 , wherein the bottom S/D contact is disposed in contact with the second gate cut liner.
8 . A semiconductor structure comprising:
a stacked field effect transistor (FET) comprising a top FET and a bottom FET;
a bottom source/drain (S/D) contact jumper connection disposed within a gate cut region, wherein the gate cut region comprises a first liner spacer and a dielectric fill disposed within the first liner spacer, and wherein the bottom S/D contact jumper is formed within the dielectric fill;
a top S/D contact fly-over disposed over a bottom S/D contact in contact with the bottom S/D contact jumper;
a top S/D access metal track disposed over the bottom S/D contact through the top S/D contact;
a first gate cut liner facing the top S/D contact fly-over, wherein the first gate cut liner is recessed; and
a second gate cut liner facing a non-fly-over top S/D contact, wherein the second gate cut liner is partially recessed.
9 . The semiconductor structure of claim 8 , further comprising a single height cell comprising the stacked FET, wherein the top S/D contact fly-over connects a first source of a top FET of the stacked FET, using the bottom S/D contact jumper, to:
a drain of the stacked FET; and
a second source of a second device.
10 . The semiconductor structure of claim 8 , further comprising a double height cell comprising the stacked FET, wherein the top S/D contact fly-over connects a first source of a bottom FET of the stacked FET, using the bottom S/D contact jumper, to a second drain of a top FET of a second stacked FET.
11 . The semiconductor structure of claim 8 , wherein the contact fly-over connects the bottom contact jumper of a first cell of the semiconductor structure to a bottom contact jumper of a second cell disposed in a same device layer of the first cell.
12 . The semiconductor structure of claim 8 , wherein the contact fly-over connects the bottom contact jumper of a first cell of the semiconductor structure to a bottom contact jumper of a second cell disposed in a different device layer from the first cell.
13 . The semiconductor structure of claim 8 , wherein the contact fly-over is disposed over, and in contact with, a top S/D epitaxial of the stacked FET.
14 . The semiconductor structure of claim 8 , wherein the bottom S/D contact is disposed in contact with the second gate cut liner.
15 . A method for fabricating a semiconductor structure, the method comprising:
forming a top field effect transistor (FET) comprising a top gate, over a bottom FET comprising a bottom gate, wherein the top FET is in contact with a top source/drain (S/D) epitaxial, and wherein the bottom FET is in contact with a bottom S/D epitaxial;
forming a cut region at a boundary to a cell comprising the top FET and bottom FET;
forming a first liner spacer in the cut region;
perform a dielectric fill in the first liner spacer;
forming a bottom S/D contact jumper in the dielectric fill;
forming a bottom S/D contact with a contact recess; and
forming a top S/D contact fly-over over the bottom S/D contact, wherein the bottom S/D contact is in contact with the bottom S/D contact jumper.
16 . The method of claim 15 , further comprising forming a plurality of additional vias.
17 . The method of claim 16 , further comprising forming a plurality of metal lines in contact with one of the plurality of additional vias, wherein the one via connects the plurality of metal lines to the top S/D contact.
18 . The method of claim 17 , wherein the top S/D contact fly-over connects a first source of the top FET, using the bottom S/D contact jumper, to:
a drain of the top FET; and
a second source of a second device.
19 . The method of claim 18 , wherein the top S/D contact fly-over connects a first source of a bottom FET associated with the top FET, using the bottom S/D contact jumper, to a second drain of a top FET of a stacked FET.
20 . The method of claim 16 , wherein the top S/D contact fly-over connects the bottom contact jumper of a first cell of the semiconductor structure to a bottom contact jumper of a second cell disposed in a same device layer of the first cell.