Imaging optical system, camera module and electronic device
An imaging optical system includes an infrared light absorbing element, an infrared light reducing film and a plate element in order along a paraxial path. The infrared light absorbing element is made of an infrared light absorbing plastic material, and the infrared light absorbing element is configured to refract a light. The infrared light reducing film is closer to an image surface of the imaging optical system than an incident surface of the infrared light absorbing element to the image surface of the imaging optical system. The plate element is disposed between the infrared light reducing film and the image surface, the plate element includes a translucent portion, a holder portion and a taper structure coating. The taper structure coating is disposed on at least one of an incident surface and an exit surface of the translucent portion.
1 . An imaging optical system comprising, in order along a paraxial path:
an infrared light absorbing element made of an infrared light absorbing plastic material, and the infrared light absorbing element configured to refract a light;
an infrared light reducing film closer to an image surface of the imaging optical system than an incident surface of the infrared light absorbing element to the image surface of the imaging optical system;
a plate element comprising a translucent portion and a holder portion, wherein the translucent portion is disposed between the infrared light reducing film and the image surface, the translucent portion and the image surface are correspondingly disposed, the holder portion surrounds the paraxial path, and the holder portion and the translucent portion are integrated formed, so as to keep the translucent portion on a specific position on the paraxial path; and
a low reflecting film disposed on at least one of an incident surface and an exit surface of the translucent portion and simultaneously coated on at least one portion of the holder portion;
wherein an average reflectivity of a light at a wavelength range between 420 nm and 680 nm is less than 0.98% via the low reflecting film;
wherein a focal length of the imaging optical system is f, a distance between the infrared light absorbing element and the infrared light reducing film along the paraxial path is L1, a distance between the infrared light reducing film and the low reflecting film along the paraxial path is L2″, and the following conditions are satisfied:
0.0≤ L 1/ f≤ 0.21; and
0.21≤ L 2″/ f.
2 . The imaging optical system of claim 1 , wherein the low reflecting film comprises an anti-reflecting multilayer film comprising a plurality of high refractive index layers and a plurality of low refractive index layers, and the high refractive index layers and the low refractive index layers are alternately stacked.
3 . The imaging optical system of claim 1 , wherein the low reflecting film comprises a taper structure coating disposed on the at least one of the incident surface and the exit surface of the translucent portion, the taper structure coating is gradually sparse towards an air direction, a plurality of pores are formed on the at least one of the incident surface and the exit surface of the translucent portion, and the taper structure coating is mainly made of a ceramic material;
wherein an average crystal height of the taper structure coating is GH, and the following condition is satisfied:
60 nm≤ GH≤ 400 nm.
4 . The imaging optical system of claim 3 , wherein the average crystal height of the taper structure coating is GH, and the following condition is satisfied:
120 nm≤ GH≤ 300 nm.
5 . The imaging optical system of claim 3 , wherein the low reflecting film further comprises an intermediary layer directly contacted with the plate element, and at least one portion of the intermediary layer is contacted with an air via at least one of the pores.
6 . The imaging optical system of claim 1 , wherein an average reflectivity of a light at a wavelength range between 400 nm and 900 nm is less than 0.98% via the low reflecting film.
7 . The imaging optical system of claim 6 , wherein the average reflectivity of the light at the wavelength range between 400 nm and 900 nm is less than 0.5% via the low reflecting film.
8 . The imaging optical system of claim 1 , wherein the infrared light reducing film is disposed on an exit surface of the infrared light absorbing element.
9 . The imaging optical system of claim 1 , further comprising:
a film disposing element disposed on an image side of the infrared light absorbing element;
wherein the infrared light reducing film is disposed on one of an incident surface and an exit surface of the film disposing element.
10 . The imaging optical system of claim 9 , wherein the film disposing element is immediately adjacent to the infrared light absorbing element.
11 . The imaging optical system of claim 10 , further comprising:
a glue, the infrared light absorbing element and the film disposing element cemented via the glue.
12 . The imaging optical system of claim 1 , wherein the holder portion of the plate element is made of an opaque plastic material.
13 . The imaging optical system of claim 1 , wherein the low reflecting film is simultaneously disposed on the incident surface and the exit surface of the translucent portion;
wherein the low reflecting film disposed on the incident surface of the translucent portion comprises one of an anti-reflecting multilayer film and a taper structure coating;
wherein the low reflecting film disposed on the exit surface of the translucent portion comprises one of the anti-reflecting multilayer film and the taper structure coating.
14 . The imaging optical system of claim 1 , wherein the low reflecting film is simultaneously disposed on at least one portion of a surface of the holder portion.
15 . The imaging optical system of claim 1 , wherein the focal length of the imaging optical system is f, a thickness of the translucent portion is THI, and the following condition is satisfied:
0.005≤ THI/f≤ 0.35.
16 . A camera module, comprising:
the imaging optical system of claim 1 ; and
an image sensor disposed on the image surface of the imaging optical system.
17 . An electronic device, comprising:
at least one of the camera module of claim 16 .
18 . A camera module, comprising:
an imaging optical system, comprising:
an imaging lens assembly, comprising:
a plurality of lens elements arranged in order along a paraxial path, wherein the lens elements comprise an infrared light absorbing lens element, and the infrared light absorbing lens element is made of an infrared light absorbing plastic material;
an infrared light reducing film disposed on an exit surface of the infrared light absorbing lens element; and
a lens carrier accommodating the lens elements and the infrared light reducing film;
a plate element, comprising:
a translucent portion; and
a holder portion surrounding the paraxial path; and
a low reflecting film disposed on at least one of an incident surface and an exit surface of the translucent portion; and
an image sensor disposed on an image side of the lens carrier, the plate element disposed between the imaging lens assembly and the image sensor, the translucent portion and the image sensor correspondingly disposed, and the paraxial path passing the imaging lens assembly and then traveling to the image sensor;
wherein a specific distance between the translucent portion of the plate element and the image sensor is kept via the holder portion;
wherein an average reflectivity of a light at a wavelength range between 420 nm and 680 nm is less than 0.98% via the low reflecting film;
wherein a focal length of the imaging optical system is f, a distance between the infrared light reducing film and the low reflecting film along the paraxial path is L2″, a thickness of the translucent portion is THI, and the following conditions are satisfied:
0.21≤ L 2″/ f ; and
0.005≤ THI/f≤ 0.35.