Electronic component
An electronic component includes a ceramic body, and an external electrode on the ceramic body, the external electrode includes a base layer continuously covering an end surface of the ceramic body and a portion of a side surface bordering the end surface, and a plating layer covering the base layer, the ceramic body includes a recess open on the side surface, an opening of the recess includes a pair of edges, one edge of the opening is located within a covered region on the side surface covered with the base layer, and the other edge of the opening is spaced away from the covered region.
1 . An electronic component comprising:
a ceramic body; and
an external electrode on the ceramic body, wherein
the external electrode includes:
a base layer continuously covering an end surface of the ceramic body and a portion of a side surface bordering the end surface; and
a plating layer covering the base layer;
the ceramic body includes a recess open on the side surface, and an opening of the recess includes a pair of edges;
one edge of the pair of edges of the opening is located within a covered region on the side surface covered with the base layer; and
another edge of the pair of edges of the opening is separated from the covered region.
2 . The electronic component according to claim 1 , wherein
the one edge is located at a marginal portion of the covered region; and
an entire or substantially an entire portion of the recess is exposed from the base layer.
3 . The electronic component according to claim 1 , wherein
the one edge is located inside a marginal portion of the covered region; and
a portion of the recess is covered with the base layer, and a remainder of the recess is exposed from the base layer.
4 . The electronic component according to claim 1 , wherein
the plating layer includes an extending portion extending to the one edge of the opening of the recess beyond an edge of the base layer; and
the extending portion bulges outward into the recess so as not to be in contact with an inner surface of the recess.
5 . The electronic component according to claim 1 , wherein the plating layer includes an extending portion extending beyond an edge of the base layer and into the recess so that at least a portion of the extending portion is in contact with an inner surface of the recess.
6 . The electronic component according to claim 1 , wherein the recess has a depth of about 0.5 μm or more and about 5.0 μm or less.
7 . The electronic component according to claim 1 , wherein
the ceramic body includes a protective film covering a surface of the ceramic body;
the external electrode is provided on the protective film; and
the inner surface of the recess is exposed from the protective film.
8 . The electronic component according to claim 7 , wherein the protective film has a thickness of about 30 nm or more and about 500 nm or less.
9 . The electronic component according to claim 7 , wherein
the electronic component includes a pair of the external electrodes at both ends of the ceramic body;
the protective film includes an exposed surface exposed from the pair of external electrodes between the pair of external electrodes; and
the exposed surface includes a pair of smooth surface regions close to each of the pair of external electrodes, and a rough surface region between the pair of smooth surface regions and having surface roughness greater than surface roughness of the smooth surface region.
10 . The electronic component according to claim 9 , wherein a width of each of the smooth surface regions is about 20 μm or more and about 100 μm or less.
11 . The electronic component according to claim 7 , wherein the protective film has a thickness of about 70 nm or more and about 100 nm or less.
12 . The electronic component according to claim 1 , wherein the ceramic body has a laminate structure including a semiconductor ceramic layer and an internal electrode.
13 . The electronic component according to claim 12 , wherein the semiconductor ceramic layer includes manganese oxide as a main component.
14 . The electronic component according to claim 13 , wherein the semiconductor ceramic layer further includes at least one of nickel oxide, cobalt oxide, alumina, iron oxide, titanium oxide, zirconium oxide, copper oxide, or zinc oxide as a sub-component.
15 . The electronic component according to claim 12 , wherein the internal electrode includes at least one of Ag, Cu, or Ni.
16 . The electronic component according to claim 1 , wherein the electronic component is a thermistor.
17 . The electronic component according to claim 11 , wherein the thermistor is an NTC thermistor.
18 . The electronic component according to claim 1 , wherein the plating layer includes a first plating layer and a second plating layer covering the first plating layer.
19 . The electronic component according to claim 1 , wherein the recess has a depth of about 1.0 μm or more and about 2.5 μm or less.
20 . The electronic component according to claim 1 , wherein the ceramic body includes at least one of BaTiO 3 , CaTiO 3 , SrTiO 3 , CaZrO 3 , (BaSr)TiO 3 , Ba(ZrTi)O 3 , or (BiZn)Nb 2 O 7 .