Package structure and method for forming the same
A method for forming a package structure is provided, which includes recessing a substrate to form a trench, disposing a first stacked die package structure over the substrate, forming an underfill layer over the first stacked die package structure and in the trench, and forming a package layer over the underfill layer and in the trench.
1 . A package structure, comprising:
a substrate having a top surface;
a first stacked die package structure disposed on the top surface of the substrate; and
a package layer surrounding the first stacked die package structure, wherein the package layer has an extending portion extending into the substrate; and
an underfill layer comprising a first portion disposed below the top surface and a second portion disposed over the top surface.
2 . The package structure as claimed in claim 1 , wherein the underfill layer extends into the first stacked die package structure and covered by the package layer.
3 . The package structure as claimed in claim 2 , wherein an interface between the underfill layer and the package layer is below the top surface of the substrate.
4 . The package structure as claimed in claim 2 , further comprising a passivation layer disposed on the substrate, wherein the underfill layer is in contact with a first sidewall of the passivation layer.
5 . The package structure as claimed in claim 4 , wherein the package layer is in contact with a second sidewall of the passivation layer.
6 . The package structure as claimed in claim 1 , wherein a top surface of the substrate is spaced apart from the package layer.
7 . A package structure, comprising:
a substrate;
a first stacked die package structure stacked over a first surface the substrate, wherein a first plane is defined by the first surface; and
an underfill layer covering the first stacked die package structure and comprising a first part above the first plane and a second part below the first plane.
8 . The package structure as claimed in claim 7 , further comprising a passivation layer covering the first surface of the substrate, and the substrate is in contact with the second part of the underfill layer.
9 . The package structure as claimed in claim 8 , wherein the substrate is separated from the first part of the underfill layer by the passivation layer.
10 . The package structure as claimed in claim 8 , further comprising a package layer in contact with a top surface and a sidewall of the passivation layer.
11 . The package structure as claimed in claim 7 , further comprising a package layer disposed over the substrate, wherein a bottom surface of the package layer is lower than the first surface of the substrate.
12 . A package structure, comprising:
a substrate having a top surface;
a first stacked die package structure disposed over the top surface of the substrate;
an underfill layer disposed over the first stacked die package structure, and comprising a first portion below the top surface of the substrate; and
a package layer disposed over the underfill layer and below the top surface of the substrate.
13 . The package structure as claimed in claim 12 , further comprising a through substrate via structure below the top surface of the substrate.
14 . The package structure as claimed in claim 13 , wherein a height of the through substrate via structure is greater than a thickness of the underfill layer below the top surface of the substrate.
15 . The package structure as claimed in claim 12 , wherein a top surface of the first stacked die package structure is exposed from the package layer.
16 . The package structure as claimed in claim 12 , wherein the first stacked die package structure is surrounded by the first portion in a top view.
17 . The package structure as claimed in claim 12 , wherein the first stacked die package structure comprises a first die disposed over the substrate, and a top surface of the first die facing away from the substrate is covered by the underfill layer.
18 . The package structure as claimed in claim 17 , further comprising a first conductive connector between the first die and the substrate, and the underfill layer surrounds the first conductive connector.
19 . The package structure as claimed in claim 12 , wherein the first portion is in contact with the substrate.
20 . The package structure as claimed in claim 1 , wherein the substrate has a recess recessing from the top surface, and the first portion of the underfill layer and the extending portion of the package layer are disposed in the recess.