Fill vessels and connectors for chemical sublimators
Herein disclosed are systems and methods related to solid source chemical intermediate fill vessels. The fill vessel can include a proximate end, a distal end, and a base disposed at the proximate end that is configured to hold solid source chemical reactant therein. The intermediate fill vessel can further include a lid at the distal end comprising a second thermal conductor. The lid can include a chemical inlet, a carrier gas inlet, and a chemical outlet. The fill vessel can further include an intermediate layer that is disposed between the base and the lid. The intermediate layer may include an insulator that is configured to reduce heat flow between the base and the lid.
1 . A solid source chemical intermediate fill vessel comprising:
a proximate end;
a distal end;
a base at the proximate end configured to hold a solid source chemical reactant therein, the base comprising a first thermal conductor;
a cooling plate in thermal contact with the first thermal conductor, disposed outside of an inside volume of the fill vessel, wherein the cooling plate is configured to maintain the base at or below a first threshold temperature;
a lid at the distal end comprising a second thermal conductor, the lid comprising:
a chemical inlet configured to receive vaporized chemical reactant into the base;
a carrier gas inlet configured to receive a flow of a carrier gas therethrough; and
a chemical outlet configured to pass vaporized chemical reactant from the lid, wherein the chemical inlet, the carrier gas inlet and the chemical outlet open to the inside volume of the fill vessel through the lid; and
an intermediate layer disposed between the base and the lid and in thermal communication with the lid and the base, the intermediate layer comprising an insulator configured to reduce heat flow between the base and the lid, wherein the lid or the base, or a combination thereof are mechanically coupled to the intermediate layer, wherein the mechanical coupling comprises a gas-tight seal.
2 . The intermediate fill vessel of claim 1 , wherein the intermediate layer is disposed in contact with both the base and the lid.
3 . The intermediate fill vessel of claim 1 , further comprising a water cooler configured to maintain the base at or below the first threshold temperature.
4 . The intermediate fill vessel of claim 3 , wherein the cooling plate is disposed in contact with the base.
5 . The intermediate fill vessel of claim 1 , wherein the intermediate layer comprises one or more individual chambers including a vacuum.
6 . The intermediate fill vessel of claim 1 , wherein the first threshold temperature is about 135° C.
7 . The intermediate fill vessel of claim 1 , further comprising a heating element configured to maintain the lid at or above the first threshold temperature.
8 . The intermediate fill vessel of claim 7 , wherein the heating element comprises a rod or plate configured to heat the lid via radiation.
9 . The intermediate fill vessel of claim 1 , wherein each of the chemical inlet, the carrier gas inlet, and the chemical outlet comprise a corresponding valve configured to control a flow of gas therethrough.
10 . The intermediate fill vessel of claim 1 , wherein the chemical outlet comprises a filter configured to prevent a passage of particulate matter therethrough.
11 . The intermediate fill vessel of claim 10 , wherein a porosity of the filter is configured to prevent a passage of the reactant therethrough below a second threshold temperature and to allow a passage of the reactant therethrough at or above the second threshold temperature.
12 . The intermediate fill vessel of claim 10 , wherein the filter comprises at least one of a ceramic or a metal.
13 . The intermediate fill vessel of claim 1 , wherein a ratio of a height of the base to a height of the lid is greater than about 4.
14 . The intermediate fill vessel of claim 1 , wherein the intermediate layer is configured to maintain a temperature gradient between the lid and the base of at least 10° C.
15 . The intermediate fill vessel of claim 1 , wherein a ratio of a height of the lid to a height of the intermediate layer is greater than about 2.
16 . The intermediate fill vessel of claim 1 , wherein a cross section of the base comprises at least two flat edges.
17 . The intermediate fill vessel of claim 1 , wherein the intermediate layer comprises a ceramic or metal.
18 . The intermediate fill vessel of claim 1 , wherein the intermediate fill vessel is sized to be disposed in situ in a solid source chemical reaction chamber.
19 . A solid source chemical system comprising:
a solid source chemical intermediate fill vessel comprising:
a proximate end;
a distal end;
a base at the proximate end configured to hold a solid source chemical reactant therein, the base comprising a first thermal conductor;
a cooling plate in thermal contact with the first thermal conductor, disposed outside of an inside volume of the fill vessel, wherein the cooling plate is configured to maintain the base at or below a first threshold temperature;
a lid at the distal end comprising a second thermal conductor, the lid comprising:
a chemical inlet configured to receive vaporized chemical reactant into the base;
a carrier gas inlet configured to receive a flow of a carrier gas therethrough; and
a chemical outlet configured to pass vaporized chemical reactant from the lid, wherein the chemical inlet, the carrier gas inlet and the chemical outlet open to the inside volume of the fill vessel through the lid; and
an intermediate layer disposed between the base and the lid and in thermal communication with the lid and the base, the intermediate layer comprising an insulator configured to reduce heat flow between the base and the lid, wherein the lid or the base, or a combination thereof are mechanically coupled to the intermediate layer, wherein the mechanical coupling comprises a gas-tight seal.