IP Library › Granted Patent US 12,699,888
Granted Patent B2
US 12,699,888 · App. 17/906,085 · Granted Aug 4, 2026

Semiconductor device

Inventors: Minato Ito (Atsugi, JP); Munehiro Kozuma (Atsugi, JP); Yuki Okamoto (Ebina, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
G06N3/063G06F7/5443H10D30/6755
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Quick Facts
Patent No.
US 12,699,888
App. No.
17/906,085
Filed
Sep 12, 2022
Granted
Aug 4, 2026
Kind
B2
Art Unit
2151
USPC
708/190
Abstract

A semiconductor device with a novel structure is provided. The semiconductor device includes a plurality of memory circuits, a switching circuit, a first arithmetic circuit, and a second arithmetic circuit. The plurality of memory circuits each have a function of retaining weight data. The switching circuit has a function of switching electrical continuity and discontinuity between any one of the memory circuits and the first arithmetic circuit. The first arithmetic circuit outputs a first output signal based on product-sum operation processing of input data and the weight data selected by the switching circuit to the second arithmetic circuit. A layer including the plurality of memory circuits is provided to be stacked over a layer including the switching circuit, the first arithmetic circuit, and the second arithmetic circuit.

Claims (42)

1 . A semiconductor device comprising a plurality of memory circuits, a switching circuit, a first arithmetic circuit, and a second arithmetic circuit,

wherein the plurality of memory circuits are each configured to retain weight data,

wherein the switching circuit is configured to switch electrical continuity and discontinuity between any one of the plurality of memory circuits and the first arithmetic circuit,

wherein the first arithmetic circuit outputs a first output signal based on product-sum operation processing of input data and the weight data selected by the switching circuit to the second arithmetic circuit, and

wherein the plurality of memory circuits are provided in a layer stacked over a layer comprising the switching circuit, the first arithmetic circuit, and the second arithmetic circuit.

2 . The semiconductor device according to claim 1 ,

wherein the memory circuits each comprise a first transistor, and

wherein the first transistor comprises a semiconductor layer comprising a metal oxide in a channel formation region.

3 . The semiconductor device according to claim 2 ,

wherein the metal oxide comprises In, Ga, and Zn.

4 . The semiconductor device according to claim 1 ,

wherein the switching circuit, the first arithmetic circuit, and the second arithmetic circuit each comprise a second transistor, and

wherein the second transistor comprises a semiconductor layer comprising silicon in a channel formation region.

5 . A semiconductor device comprising a plurality of memory circuits, a switching circuit, a first arithmetic circuit, and a second arithmetic circuit,

wherein the plurality of memory circuits are each configured to retain weight data,

wherein the switching circuit is configured to switch electrical continuity and discontinuity between any one of the plurality of memory circuits and the first arithmetic circuit,

wherein the first arithmetic circuit outputs a first output signal based on product-sum operation processing of input data and the weight data selected by the switching circuit to the second arithmetic circuit,

wherein the second arithmetic circuit is configured to perform activation function operation processing, quantization operation processing, and first pooling operation processing, and

wherein the plurality of memory circuits are provided in a layer stacked over a layer comprising the switching circuit, the first arithmetic circuit, and the second arithmetic circuit.

6 . The semiconductor device according to claim 5 ,

wherein the memory circuits each comprise a first transistor, and

wherein the first transistor comprises a semiconductor layer comprising a metal oxide in a channel formation region.

7 . The semiconductor device according to claim 6 ,

wherein the metal oxide comprises In, Ga, and Zn.

8 . The semiconductor device according to claim 5 ,

wherein the switching circuit, the first arithmetic circuit, and the second arithmetic circuit each comprise a second transistor, and

wherein the second transistor comprises a semiconductor layer comprising silicon in a channel formation region.

9 . A semiconductor device comprising a plurality of memory circuits, a switching circuit, a first arithmetic circuit, a second arithmetic circuit, and a third arithmetic circuit,

wherein the plurality of memory circuits are each configured to retain weight data,

wherein the switching circuit is configured to switch electrical continuity and discontinuity between any one of the plurality of memory circuits and the first arithmetic circuit,

wherein the first arithmetic circuit outputs a first output signal based on product-sum operation processing of input data and the weight data selected by the switching circuit to the second arithmetic circuit,

wherein the second arithmetic circuit is configured to perform activation function operation processing, quantization operation processing, and first pooling operation processing,

wherein the third arithmetic circuit is configured to perform second pooling operation processing of a second output signal output from the second arithmetic circuit, and

wherein the plurality of memory circuits are provided in a layer stacked over a layer comprising the switching circuit, the first arithmetic circuit, and the second arithmetic circuit.

10 . The semiconductor device according to claim 9 ,

wherein the memory circuits each comprise a first transistor, and

wherein the first transistor comprises a semiconductor layer comprising a metal oxide in a channel formation region.

11 . The semiconductor device according to claim 10 ,

wherein the metal oxide comprises In, Ga, and Zn.

12 . The semiconductor device according to claim 9 ,

wherein the switching circuit, the first arithmetic circuit, and the second arithmetic circuit each comprise a second transistor, and

wherein the second transistor comprises a semiconductor layer comprising silicon in a channel formation region.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 12, 2022
From: ITO, MINATO; KOZUMA, MUNEHIRO; OKAMOTO, YUKI
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 061059/0303 →
Priority Claims (1)
JP 2020-067168 · Apr 3, 2020 · national
Continuity (1)
Related Publication 20230109354A1 · Apr 6, 2023
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