IP Library › Granted Patent US 12,721,165
Granted Patent B2
US 12,721,165 · App. 19/308,894 · Granted Aug 25, 2026

Semiconductor circuit structure with direct die heat removal structure

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Quick Facts
Patent No.
US 12,721,165
App. No.
19/308,894
Filed
Aug 25, 2025
Granted
Aug 25, 2026
Kind
B2
Art Unit
2812
USPC
257/712
Continuity (8)
Continuation 19210377 · May 16, 2025
Continuation 18980888 · Dec 13, 2024
Continuation 18674649 · May 24, 2024
Provisional Application 63572960 · Apr 2, 2024
Provisional Application 63555918 · Feb 21, 2024
Provisional Application 63543724 · Oct 11, 2023
Provisional Application 63523645 · Jun 28, 2023
Related Publication 20250379117A1 · Dec 11, 2025
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