IP Library › Granted Patent US 12,721,233
Granted Patent B2
US 12,721,233 · App. 18/533,800 · Granted Aug 25, 2026

Stacked semiconductor package

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Quick Facts
Patent No.
US 12,721,233
App. No.
18/533,800
Filed
Dec 8, 2023
Granted
Aug 25, 2026
Kind
B2
Examiner
OH, JAEHWAN
Art Unit
2899
USPC
257/734
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 8, 2023
From: JUNG, DAWOON; BAEK, SEUNGDUK; LEE, DONGHUN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 065813/0292 →
Priority Claims (1)
KR 10-2022-0170256 · Dec 8, 2022 · national
Continuity (1)
Related Publication 20240194648A1 · Jun 13, 2024
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