Electronic devices and methods of manufacturing electronic devices
In one example, an electronic device comprises a first substrate comprising a first dielectric structure and a first conductive structure, a first interconnect structure over an inward side of the first substrate and coupled with the first conductive structure, a first encapsulant over the inward side of the first substrate and contacting a lateral side of the first interconnect structure, a second substrate over the first encapsulant and comprising a second dielectric structure and a second conductive structure, wherein the second conductive structure is coupled with the first interconnect structure, and a first electronic component coupled with an outward side of the first substrate. The first electronic component is coupled with the second conductive structure via the first interconnect structure and the first conductive structure. Other examples and related methods are also disclosed herein.
1 . An electronic device, comprising:
a first substrate comprising a first dielectric structure and a first conductive structure;
a first interconnect structure over an inward side of the first substrate and coupled with the first conductive structure;
a first encapsulant over the inward side of the first substrate and contacting a lateral side of the first interconnect structure;
a second substrate over the first encapsulant and comprising a second dielectric structure and a second conductive structure, wherein the second conductive structure is coupled with the first interconnect structure; and
a first electronic component coupled with an outward side of the first substrate;
wherein the first electronic component is coupled with the second conductive structure via the first interconnect structure and the first conductive structure; and
wherein the first interconnect structure comprises:
an interconnect encapsulant; and
a metal interconnect bounded by the interconnect encapsulant.
2 . The electronic device of claim 1 , comprising:
a second encapsulant over an outward side of the second substrate and covering the second conductive structure;
wherein the second encapsulant comprises a first material and the second dielectric structure comprises a second material different than the first material.
3 . The electronic device of claim 1 , wherein:
the second conductive structure comprises an antenna pattern.
4 . The electronic device of claim 1 , comprising:
a second encapsulant coupled with the outward side of the first substrate and contacting a lateral side of the first electronic component.
5 . The electronic device of claim 4 , comprising:
a lid coupled with an outward side of the second encapsulant.
6 . The electronic device of claim 5 , comprising:
a thermal interface material between the first electronic component and the lid; wherein:
the first electronic component comprises a metal layer on a backside of the first electronic component; and
the metal layer is coupled with the thermal interface material.
7 . The electronic device of claim 1 , wherein:
the first substrate comprises a first redistribution layer (RDL) substrate; and
the second substrate comprises a second RDL substrate.
8 . An electronic device, comprising:
a first substrate comprising a first dielectric structure and a first conductive structure;
a first interconnect structure over a top side the first substrate and coupled with the first conductive structure;
a first encapsulant over the first substrate and contacting a lateral side of the first interconnect structure;
a second substrate over the first encapsulant and comprising a second dielectric structure and a second conductive structure, wherein the second conductive structure is coupled with the first interconnect structure;
a first electronic component over a top side of the second substrate and coupled with the second conductive structure;
a second electronic component coupled with the second conductive structure; and
a second encapsulant over the top side of the second substrate and contacting a lateral side of the first electronic component;
wherein the first interconnect structure comprises:
an interconnect encapsulant; and
a metal interconnect bounded by the interconnect encapsulant.
9 . The electronic device of claim 8 , wherein:
the second electronic component comprises a decoupling capacitor.
10 . The electronic device of claim 8 , wherein:
the second electronic component is coupled with a bottom side of the second substrate; and
the second electronic component is in the first encapsulant and at least partially within a footprint of the first electronic component.
11 . The electronic device of claim 8 , wherein:
the second electronic component is coupled with the top side of the second substrate; and
the second electronic component is in the second encapsulant.
12 . The electronic device of claim 8 , comprising:
a third electronic component coupled with the second conductive structure;
wherein the second electronic component and third electronic component are on opposite sides of the second substrate.
13 . The electronic device of claim 8 , wherein:
the first substrate comprises a first redistribution layer (RDL) substrate; and
the second substrate comprises a second RDL substrate.
14 . A method to manufacture an electronic device, comprising:
providing a first interconnect structure;
providing a first encapsulant contacting a lateral side of the first interconnect structure;
providing a first substrate coupled with a first side of the first encapsulant, wherein the first substrate comprises a first dielectric structure and a first conductive structure, and wherein the first conductive structure is coupled with the first interconnect structure;
providing a second substrate coupled with a second side of the first encapsulant, wherein the second substrate comprises a second dielectric structure and a second conductive structure, and wherein the second conductive structure is coupled with the first interconnect structure; and
providing a first electronic component coupled with the first substrate;
wherein the first electronic component is coupled with the second conductive structure via the first interconnect structure and the first conductive structure; and
wherein the first interconnect structure comprises:
an interconnect encapsulant; and
a metal interconnect bounded by the interconnect encapsulant.
15 . The method of claim 14 , comprising:
providing a second encapsulant coupled with the second substrate and covering the second conductive structure.
16 . The method of claim 14 , wherein:
the second conductive structure comprises an antenna pattern.
17 . The method of claim 14 , comprising:
providing a second encapsulant coupled with the first substrate and contacting a lateral side of the first electronic component.