IP Library › Granted Patent US 7,631,422

Granted Patent B2

US 7,631,422 · App. 11/440,113 · Granted Dec 15, 2009

Method of manufacturing wiring substrate having terminated buses

Assignees: Kanji Otsuka; Tamotsu Usami; Rohm Co., Ltd.; Oki Semiconductor Co., Ltd.; Sanyo Electric Co., Ltd.; Sony Corporation; Kabushiki Kaisha Toshiba; NEC Corporation; Sharp Kabushiki Kaisha; Renesas Technology Corp.; Fujitsu Microelectronics Limited; Panasonic Corporation

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Quick Facts

Patent No.: US 7,631,422
App. No.: 11/440,113
Filed: May 25, 2006
Granted: Dec 15, 2009
Kind: B2
Examiner: CAZAN, LIVIUS RADU
Art Unit: 3729
USPC: 29/830

External Links

USPTO Patent Center↗ Full Patent PDF↗

Abstract

A terminal resistor is provided at the end of a bus formed on a wiring substrate. An insulator having a large dielectric loss angle is provided in the vicinity of the terminal resistor to absorb high frequency electromagnetic waves in the vicinity. This arrangement permits successful transmission of digital signals in the GHz region using a conventional terminal resistor.

Claims (7)

1. A method of manufacturing a wiring substrate, comprising steps of:

preparing an insulative substrate having thereon a stacked pair of parallel transmission lines;

mounting and connecting a terminal chip resistor with the terminal ends of said stacked pair of parallel transmission lines, said terminal chip resistor having a resistance that matches the characteristic impedance of said stacked pair of parallel transmission lines to minimize the reflection of waves in said stacked pair of parallel transmission lines;

preparing a sticky organic potting resin solution having a larger dielectric loss angle than said insulative substrate at least in the frequency range of digital signals to be transmitted by said stacked pair of parallel transmission lines;

dropping said sticky organic potting resin solution onto said terminal chip resistor and the vicinity thereof for potting; and

hardening said organic potting resin;

wherein said sticky organic potting resin solution includes a thermosetting organic material containing a hydroxyl radical.

Assignments (16)

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2021

From: PANASONIC CORPORATION

To: NUVOTON TECHNOLOGY CORPORATION JAPAN

Reel/Frame 055502/0185 →

CORRECTIVE ASSIGNMENT TO CORRECT THE EIGHTH ASSIGNEE NAME AND ADDRESS PREVIOUSLY RECORDED AT REEL: 031174 FRAME: 0452. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 19, 2018

From: LAPIS SEMICONDUCTOR CO., LTD.

To: OTSUKA, KANJI; USAMI, TAMOTSU; ROHM CO., LTD; SANYO ELECTRIC CO., LTD.; SONY CORPORATION; KABUSHIKI KAISHA TOSHIBA; NEC CORPORATION; RENESAS ELECTRONICS CORPORATION; PANASONIC CORPORATION; FUJITSU SEMICONDUCTOR LIMITED

Reel/Frame 045095/0561 →

CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME AND THE ADDRESS PREVIOUSLY RECORDED ON REEL 044070 FRAME 0960. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 19, 2018

From: NEC CORPORATION; FUJITSU SEMICONDUCTOR LIMITED

To: OTSUKA, KANJI; USAMI, TAMOTSU; ROHM CO., LTD.; SANYO ELECTRIC CO., LTD.; KABUSHIKI KAISHA TOSHIBA; RENESAS ELECTRONICS CORPORATION; PANASONIC CORPORATION

Reel/Frame 045096/0617 →

CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME AND ADDRESS PREVIOUSLY RECORDED AT REEL: 028986 FRAME: 0607. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT . Recorded Jan 19, 2018

From: SHARP KABUSHIKI KAISHA

To: OTSUKA, KANJI; USAMI, TAMOTSU; ROHM CO., LTD.; SANYO ELECTRIC CO., LTD.; SONY CORPORATION; KABUSHIKI KAISHA TOSHIBA; NEC CORPORATION; RENESAS ELECTRONICS CORPORATION; PANASONIC CORPORATION; OKI SEMICONDUCTOR CO., LTD.; FUJITSU SEMICONDUCTOR LIMITED

Reel/Frame 045101/0374 →

CORRECTIVE ASSIGNMENT TO CORRECT THE SEVENTH ASSIGNEE'S NAME AND ADDRESS PREVIOUSLY RECORDED AT REEL: 033487 FRAME: 0476. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 19, 2018

From: SONY CORPORATION

To: OTSUKA, KANJI; USAMI, TAMOTSU; ROHM CO., LTD.; SANYO ELECTRIC CO., LTD.; KABUSHIKI KAISHA TOSHIBA; NEC CORPORATION; RENESAS ELECTRONICS CORPORATION; PANASONIC CORPORATION; FUJITSU SEMICONDUCTOR LIMITED

Reel/Frame 045167/0005 →

CHANGE OF ADDRESS Recorded Nov 29, 2017

From: RENESAS ELECTRONICS CORPORATION

To: RENESAS ELECTRONICS CORPORATION

Reel/Frame 044928/0001 →

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 29, 2017

From: NEC CORPORATION; FUJITSU SEMICONDUCTOR LIMITED

To: OTSUKA, KANJI; USAMI, TAMOTSU; ROHM CO., LTD.; SANYO ELECTRIC CO., LTD.; KABUSHIKI KAISHA TOSHIBA; RENESAS TECHNOLOGY CORP.; PANASONIC CORPORATION

Reel/Frame 044070/0960 →

CHANGE OF ADDRESS Recorded Jul 21, 2017

From: FUJITSU SEMICONDUCTOR LIMITED

To: FUJITSU SEMICONDUCTOR LIMITED

Reel/Frame 043289/0749 →

MERGER AND CHANGE OF NAME Recorded Sep 9, 2014

From: RENESAS TECHNOLOGY CORP.; NEC ELECTRONICS CORPORATION

To: RENESAS ELECTRONICS CORPORATION

Reel/Frame 033698/0648 →

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2014

From: SONY CORPORATION

To: OTSUKA, KANJI; USAMI, TAMOTSU; ROHM CO., LTD.; SANYO ELECTRIC CO., LTD.; KABUSHIKI KAISHA TOSHIBA; NEC CORPORATION; RENESAS TECHNOLOGY CORP.; PANASONIC CORPORATION; FUJITSU SEMICONDUCTOR LIMITED

Reel/Frame 033487/0476 →

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2013

From: LAPIS SEMICONDUCTOR CO., LTD.

To: OTSUKA, KANJI; USAMI, TAMOTSU; ROHM CO., LTD; SANYO ELECTRIC CO., LTD; SONY CORPORATION; KABUSHIKI KAISHA TOSHIBA; NEC CORPORATION; RENESAS TECHNOLOGY CORP.; PANASONIC CORPORATION; FUJITSU SEMICONDUCTOR LIMITED

Reel/Frame 031174/0452 →

CHANGE OF NAME Recorded Aug 30, 2013

From: OKI SEMICONDUCTOR CO., LTD.

To: LAPIS SEMICONDUCTOR CO., LTD.

Reel/Frame 031125/0334 →

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2012

From: SHARP KABUSHIKI KAISHA

Reel/Frame 028986/0607 →

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 6, 2010

From: FUJITSU MICROELECTRONICS LIMITED

To: FUJITSU SEMICONDUCTOR LIMITED

Reel/Frame 024794/0802 →