Granted Patent B2

US 8,236,607 · App. 12/488,383 · Granted Aug 7, 2012

Abstract

Claims (51)

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a substrate;

attaching a base component to the substrate by a first interconnect;

attaching a second interconnect to the substrate adjacent to the base component, with the first interconnect between the second interconnect and the base component;

attaching a stack component connected by a second interconnect to the substrate and directly over the base component, the first interconnect, and the second interconnect;

molding an encapsulation over the base component, the first interconnect, the stack component, and the second interconnect; and

removing the substrate to partially expose the first interconnect and the second interconnect from the encapsulation.

2. The method as claimed in claim 1 further comprising connecting the base component and the stack component with a third interconnect different from the first interconnect.

3. The method as claimed in claim 1 further comprising attaching a further stack component over the stack component.

4. The method as claimed in claim 1 further comprising attaching a further stack component over the stack component, the further stack component connected by a further interconnect to the substrate.

5. The method as claimed in claim 1 further comprising attaching a further stack component over the stack component, the further stack component of a different size from the stack component.

6. A method of manufacture of an integrated circuit packaging system comprising:

providing a substrate;

forming a first bond pad and a second bond pad on the substrate;

connecting a first conductive ball on the first bond pad;

attaching a base component over the substrate with the second bond pad between the base component and the first bond pad;

connecting a first conductive wire between the base component and the second bond pad;

connecting a stack component to the first conductive ball and directly over the first interconnect, the second interconnect, and the base component;

molding an encapsulation over the base component, the first conductive ball, the first bond pad, the stack component, the first conductive wire, and the second bond pad; and

removing the substrate to partially expose the first bond pad and the second bond pad from the encapsulation.

7. The method as claimed in claim 6 further comprising connecting the base component and the stack component with a second conductive ball different from the first conductive ball.

8. The method as claimed in claim 6 further comprising attaching a further stack component over the stack component, the further stack component connected by conductive wires at each end of the further stack component to the substrate.

9. The method as claimed in claim 6 further comprising attaching a further stack component over the stack component, the further stack component connected only at one end by a conductive wire to the substrate.

10. The method as claimed in claim 6 further comprising a further stack component over the stack component, the further stack component of a different thickness from the stack component.

11. An integrated circuit packaging system comprising:

a base component;

a first interconnect attached to the base component;

a second interconnect adjacent to the base component, with the first interconnect between the second interconnect and the base component;

a stack component directly over the base component, the first interconnect, and the second interconnect, and connected to the second interconnect; and

an encapsulation over the base component, the first interconnect, the stack component, and the second interconnect, with the first interconnect and the second interconnect partially exposed from the encapsulation.

12. The system as claimed in claim 11 further comprising a third interconnect connected to the base component and the stack component, the third interconnect different from the first interconnect.

13. The system as claimed in claim 11 further comprising a further stack component over the stack component.

14. The system as claimed in claim 11 further comprising:

a further stack component over the stack component; and

a further interconnect connected to the further stack component.

15. The system as claimed in claim 11 further comprising a further stack component over the stack component, the further stack component of a different size from the stack component.

16. The system as claimed in claim 11 further comprising:

a first bond pad;

a second bond pad adjacent to the first bond pad with the second bond pad between the first bond pad and the base component;

a first conductive ball on the first bond pad and connected to the stack component;

wherein:

the first interconnect includes a first conductive wire and the second bond pad; and

the encapsulation is over the first conductive ball, the first bond pad, the first conductive wire, and the second bond pad, the first bond pad and the second bond pad partially exposed from the encapsulation.

17. The system as claimed in claim 16 further comprising a second conductive ball connected to the base component and the stack component, the second conductive ball different from the first conductive ball.

18. The system as claimed in claim 16 further comprising:

a further stack component over the stack component; and

conductive wires connected to the further stack component at each end of the further stack component.

19. The system as claimed in claim 16 further comprising:

a further stack component over the stack component; and

a conductive wire connected only at one end to the further stack component.

20. The system as claimed in claim 16 further comprising a further stack component over the stack component, the further stack component of a different thickness from the stack component.

Assignments (6)