Integrated circuit package system with heat slug
View Patent ↗An integrated circuit package system is provided including providing a substrate having a die attached and electrically bonded thereto. The system includes forming heat slug pillars on the substrate, positioning a heat slug on the heat slug pillars, and encapsulating the substrate, the die, the heat slug pillars, and the heat slug in a mold compound. The system includes singulating the substrate, the die, the heat slug, and the mold compound.
1. An integrated circuit package system comprising:
providing a substrate having a die attached and electrically bonded thereto;
forming heat slug pillars on the substrate;
positioning a heat slug on the heat slug pillars and including providing the heat slug with a groove around the periphery thereof inside the heat slug pillars when positioned;
encapsulating the substrate, the die, the heat slug pillars, and the heat slug in a mold compound; and
singulating the substrate, the die, the heat slug, and the mold compound to eliminate the heat slug pillars.
2. The system as claimed in claim 1 wherein positioning the heat slug on the heat slug pillars includes bonding the heat slug to the heat slug pillars.
3. The system as claimed in claim 1 wherein positioning the heat slug includes providing the heat slug with indentations provided therein for heat dissipation thereby.
4. The system as claimed in claim 1 wherein positioning the heat slug includes providing the heat slug with lines for individual heat slugs connected by tie bars.
5. An integrated circuit package system comprising:
providing a substrate having dies attached and electrical bonds thereto;
applying pillars of adhesive around the periphery of the substrate;
placing a heat slug on the pillars of adhesive;
molding the heat slug, the pillars of adhesive, the dies, and the substrate in a molding compound;
mounting solder balls on the substrate for electrically connecting to the dies; and
singulating the substrate, the mold compound, and the heat slug into integrated circuit packages without the pillars of adhesive.
6. The system as claimed in claim 5 wherein placing the heat slug places the heat slug above the dies and electrical bonds.
7. The system as claimed in claim 5 wherein placing the heat slug includes providing the heat slug with indentions provided therein.
8. The system as claimed in claim 5 wherein placing the heat slug includes providing the heat slug with a groove around the periphery thereof inside the heat slug pillars and out side the electrical bonds when positioned.
9. The system as claimed in claim 5 wherein placing the heat slug includes providing the heat slug with full-etched lines for individual heat slugs connected by tie bars.