Stacked integrated circuit leadframe package system
View Patent ↗A stacked integrated circuit leadframe package system including forming a leadframe, packaging a top integrated circuit on a one side of the leadframe, packaging a bottom integrated circuit on an opposite side of the leadframe, and forming external electrical interconnects on the leadframe.
1. A stacked integrated circuit leadframe package system comprising:
forming a flat leadframe;
packaging a top integrated circuit on a one side of the leadframe;
packaging a bottom integrated circuit on an opposite side of the leadframe;
encapsulating the bottom integrated circuit with an encapsulant having vertical sides; and
forming solder balls on the leadframe, the solder balls having vertical sides abutting the vertical sides of the encapsulant.
2. The system as claimed in claim 1 wherein forming the leadframe further comprises forming a leadframe array having multiple leadframes.
3. The system as claimed in claim 1 wherein packaging the top integrated circuit further comprises mounting a further integrated circuit on the top integrated circuit.
4. The system as claimed in claim 1 wherein:
packaging the top integrated circuit or packaging the bottom integrated circuit further comprises applying an adhesive tape between the top integrated circuit or the bottom integrated circuit and the leadframe;
removing the adhesive tape, and
bonding the bottom integrated circuit and the top integrated circuit.
5. The system as claimed in claim 1 wherein packaging the bottom integrated circuit further comprises attaching a chip scale package to the leadframe.
6. A stacked integrated circuit leadframe package system comprising:
forming a flat leadframe;
mounting a top integrated circuit on a one side of the leadframe;
electrically connecting the top integrated circuit to the one side of the leadframe;
encapsulating the top integrated circuit with the one side of the leadframe;
mounting a bottom integrated circuit on an opposite side of the leadframe;
electrically connecting the bottom integrated circuit to the opposite side of the leadframe;
encapsulating the bottom integrated circuit with the opposite side of the leadframe with an encapsulant having vertical sides; and
depositing solder balls on the leadframe, the solder balls having vertical sides abutting the vertical sides of the encapsulant.
7. The system as claimed in claim 6 wherein packaging the top or bottom integrated circuit further comprises:
mounting a further integrated circuit on the top integrated circuit; and
electrically connect the further integrated circuit to the one side of the leadframe.
8. The system as claimed in claim 6 wherein:
packaging the top integrated circuit or packaging the bottom integrated circuit further comprises applying an adhesive tape between the top integrated circuit or the bottom integrated circuit and the leadframe;
removing the adhesive tape;
bonding the bottom integrated circuit and the top integrated circuit.
9. The system as claimed in claim 6 wherein mounting the bottom integrated circuit further comprises:
mounting the bottom integrated circuit in a chip scale package; and
mounting the chip scale package on the opposite side of the leadframe.
10. The system as claimed in claim 6 wherein forming the leadframe further comprises:
forming a further leadframe attached to the opposite side of the leadframe with the bottom integrated circuit attached thereto.