IP Library Granted Patent US 7,429,733
Granted Patent B2
US 7,429,733 · App. 11/323,405 · Granted Sep 30, 2008

Method and sample for radiation microscopy including a particle beam channel formed in the sample source

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Quick Facts
Patent No.
US 7,429,733
App. No.
11/323,405
Granted
Sep 30, 2008
Kind
B2
Abstract

A method and sample for radiation microscopy include a sample source that includes an area of interest, an outer side of a sample formed in the sample source adjacent to the area of interest, an inner side of the sample formed inside the sample source wherein at least a portion of the area of interest is included between the inner side of the sample and the outer side, and a particle beam channel formed inside the sample source for conducting a particle beam to or from the inner side of the sample.

Claims (23)

1. A method comprising steps of:

providing a sample source that includes an area of interest;

forming an outer side of a sample in the sample source adjacent to the area of interest;

forming an inner side of the sample inside the sample source, the sample including at least a portion of the area of interest between the inner side of the sample and the outer side;

forming a particle beam channel inside the sample source for conducting a particle beam to or from the inner side of the sample; and

forming a coating on the particle beam channel for one of generating a beam of secondary electrons and reflecting the particle beam.

2. The method of claim 1 further comprising forming the coating comprising one of platinum, silver, and gold.

3. The method of claim 1 further comprising including a portion of a semiconductor wafer in the sample source.

4. The method of claim 1 further comprising including in the sample one of a polysilicon gate of a transistor, a via, an oxide layer, and a polysilicon layer.

5. The method of claim 1 further comprising forming the particle beam channel to conduct a beam comprising electrons or photons.

6. The method of claim 1 further comprising forming the outer side from zero to about 20 microns from the area of interest.

7. The method of claim 1 further comprising forming the particle beam channel including an angular surface, the angular surface formed at an acute angle adjacent to the inner side.

8. An apparatus comprising:

a sample source that includes an area of interest; an outer side of a sample formed in the sample source adjacent to the area of interest;

an inner side of the sample formed inside the sample source, the sample including at least a portion of the area of interest between the inner side of the sample and the outer side;

a particle beam channel formed inside the sample source for conducting a particle beam to or from the inner side of the sample; and

a coating formed on the particle beam channel for one of generating a beam of secondary electrons and reflecting the particle beam.

9. The sample of claim 8 , the coating comprising one of platinum, silver, and gold.

10. The sample of claim 8 , the sample source comprising a portion of a semiconductor wafer.

11. The sample of claim 8 , the sample comprising one of a polysilicon gate, a via, an oxide layer, and a polysilicon layer.

12. The sample of claim 8 , the outer side formed from zero to about 20 microns from the area of interest.

13. The sample of claim 8 , the particle beam channel formed to conduct a beam comprising electrons or photons.

14. The apparatus of claim 8 , the particle beam channel comprising an angular surface, the angular surface formed at an acute angle adjacent to the inner side.

Assignments (11)
SECURITY INTEREST Recorded Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 060885/0001 →
SECURITY INTEREST Recorded Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032856-0031) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035390/0388 →
CHANGE OF NAME Recorded Jun 6, 2014
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 033102/0270 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
MERGER Recorded Feb 19, 2008
From: LSI SUBSIDIARY CORP.
To: LSI CORPORATION
Reel/Frame 020548/0977 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 13, 2006
From: SCHMIDT, MICHAEL B.; MYERS, TRACY D.
To: LSI LOGIC CORPORATION
Reel/Frame 017334/0968 →