Wafer chucking apparatus for spin processor
View Patent ↗A wafer chuck is configured to hold a wafer efficiently for spin process cleaning of wafer edges and back sides. A first group of retractable tips extend to hold the wafer during a first portion of the cleaning period. A second group of retractable tips extend to hold the wafer during a second portion of the cleaning period. Residues left between the tips and the wafer edge areas during the first portion of the cleaning period are removed during the second portion. The change from the first group of tips to the second group of tips occurs while the wafer is rotating.
1. A wafer chuck for supporting a wafer during spin process cleaning of edges, bevels, and backsides of a wafer, the wafer chuck comprising:
a first plurality of retractable wafer chuck tips to engage the edge of the wafer by extending the first set of retractable wafer chuck tips from the wafer chuck in a direction substantially parallel to the axis of rotation of the wafer chuck; and
a second plurality of retractable wafer chuck tips to engage the edge of the wafer by extending the second plurality of retractable wafer chuck tips from the wafer chuck in a direction substantially parallel to the axis of rotation of the wafer chuck, wherein the first and second pluralities of retractable wafer chuck tips are configured so that in a first state the first plurality of retractable wafer chuck tips are engaged with the edge of the wafer and the second plurality of retractable wafer chuck tips are not engaged with the edge of the wafer and wherein in a second state the first plurality of retractable wafer chuck tips are not engaged with the edge of the wafer and the second plurality of retractable wafer chuck tips are engaged with the edge of the wafer.
2. The wafer chuck as recited in claim 1 , wherein the first and second pluralities of retractable wafer chuck tips are coupled with a drive mechanism for engaging the tips with the wafer edge.
3. The wafer chuck as recited in claim 2 , wherein the drive mechanism is a hydraulic drive mechanism.
4. The wafer chuck as recited in claim 2 , wherein the drive mechanism is one of a pneumatic, electromagnetic, or mechanical drive mechanism.
5. The wafer chuck as recited in claim 1 , wherein the first plurality of retractable wafer chuck tips comprises 3 tips.
6. The wafer chuck as recited in claim 1 , wherein each of the first and second pluralities of retractable wafer chuck tips comprises 3 tips.
7. The wafer chuck as recited in claim 2 , wherein the first and second pluralities of retractable wafer chuck tips are placed in one of the first and second states by a controller coupled to the drive mechanism.
8. The wafer chuck as recited in claim 2 , wherein the drive mechanism includes individually controllable drive units for each tip in each of the first and second pluralities of retractable wafer chuck tips.
9. The wafer chuck as recited in claim 1 , further comprising a third plurality of retractable wafer chuck tips to engage the edge of the wafer by extending the third set of retractable wafer chuck tips from the wafer chuck in a direction substantially parallel to the axis of rotation of the wafer chuck, and wherein the first, second, and third pluralities of retractable wafer chuck tips are configured so that in a third state the first and second pluralities of retractable wafer chuck tips are not engaged with the edge of the wafer and the third plurality of retractable wafer chuck tips is engaged with the edge of the wafer.
10. The wafer chuck as recited in claim 9 , wherein the first, second, and third pluralities of retractable wafer chuck tips are configured to enter the second state after the first state and to enter the third state after the second state, each state occurring during the continuous rotation of the wafer.
11. The wafer chuck as recited in claim 9 , wherein each of the first and second and third pluralities of retractable wafer chuck tips comprises 3 tips.