IP Library Granted Patent US 7,408,227
Granted Patent B2
US 7,408,227 · App. 11/524,107 · Granted Aug 5, 2008

Apparatus and method of manufacture for integrated circuit and CMOS device including epitaxially grown dielectric on silicon carbide

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,408,227
App. No.
11/524,107
Granted
Aug 5, 2008
Kind
B2
Abstract

An integrated circuit, or portion thereof, such as a CMOS device, includes an epitaxially grown dielectric on a silicon carbide base. The epitaxially grown dielectric forms a gate dielectric and the silicon carbide base serves as a channel region for the CMOS device. In various embodiments, the epitaxially grown dielectric may be a crystalline carbon or carbon-containing film.

Claims (22)

1. An integrated circuit comprising:

a silicon carbide base;

a dielectric film epitaxially grown on the silicon carbide base, the epitaxially grown dielectric film including crystalline carbon; and

a CMOS device including a channel region formed in the silicon carbide base and a gate dielectric formed by the epitaxially grown dielectric film.

2. An integrated circuit as defined in claim 1 wherein:

the epitaxially grown dielectric film has a dielectric constant larger than 4.5.

3. An integrated circuit as defined in claim 1 further comprising:

a silicon substrate;

wherein the silicon carbide base is formed on the silicon substrate.

4. An integrated circuit as defined in claim 1 wherein:

the silicon carbide base comprises a silicon carbide substrate.

5. An integrated circuit as defined in claim 1 further comprising:

a silicon carbide region formed on the epitaxially grown dielectric film;

wherein the CMOS device further includes a gate electrode formed by the silicon carbide region.

6. An integrated circuit as defined in claim 3 wherein:

the silicon carbide base is epitaxially grown on the silicon substrate.

7. An integrated circuit as defined in claim 6 wherein:

the epitaxially grown silicon carbide base is a strained silicon carbide film.

8. An integrated circuit as defined in claim 5 wherein:

the silicon carbide region is epitaxially grown on the epitaxially grown dielectric film.

9. An integrated circuit as defined in claim 5 wherein:

the silicon carbide region is deposited on the epitaxially grown dielectric film.

Assignments (11)
SECURITY INTEREST Recorded Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 060885/0001 →
SECURITY INTEREST Recorded Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032856-0031) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035390/0388 →
CHANGE OF NAME Recorded Jun 6, 2014
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 033102/0270 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
MERGER Recorded Feb 19, 2008
From: LSI SUBSIDIARY CORP.
To: LSI CORPORATION
Reel/Frame 020548/0977 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2006
From: SUVKHANOV, AGAJAN; MIRABEDINI, MOHAMMAD R.
To: LSI LOGIC CORPORATION
Reel/Frame 018333/0296 →