Workpiece gripping device
A gripper for use with a robot includes a support body for removably attaching the gripper to a moveable arm and a workpiece contact body having a groove extending along at least a portion of the contact body for engaging a curved outer edge of the workpiece. A coupling member connects the support body to the workpiece contact member and includes a flexure component that flexes to allow radial and/or tangential relative movement of the workpiece contact body with respect to the support body to diminish slippage between the workpiece and the contact body as the gripper engages the workpiece.
1. Apparatus for holding a semiconductor wafer during movement and/or rotation of the wafer comprising:
a) first and second elongated arms for trapping a wafer between said arms for movement and/or rotation;
b) at least three grippers mounted to the first and second elongated arms; and
d) a drive for relatively moving the first and second arms with respect to each other to grasp the wafer with all three grippers;
e) wherein one gripper comprises
i) a support body for removably attaching the one gripper to the first or second elongated arms;
ii) a workpiece contact body for engaging an edge of the wafer; and
iii) a coupling member having a flexure component having two flexure arms connecting the contact body to the support body that bend in response to contact with the wafer and allow relative movement of said support body and said workpiece contact body to diminish contact forces between the workpiece and the contact body as the gripper engages the wafer.
2. The gripper of claim 1 wherein the flexure arms are coupled to the support body and spaced along a portion of their length by a gap that separates a portion of the flexure arms from the contact body.
3. Then gripper of claim 1 wherein a portion of the two flexure arms are spaced from the support body by first and second elongated gaps that extends along opposite sides of the support body.