Integrated circuit packaging system with package-in-package and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing a package substrate, having a component side and a system side; mounting a first integrated circuit die on the component side of the package substrate; mounting a second integrated circuit die on the component side of the package substrate; mounting an internal package, having an internal die, over the first integrated circuit die; coupling chip interconnects between the first integrated circuit die, the second integrated circuit die, the internal die, the component side, or a combination thereof, and forming a stacked package body by encapsulating the component side, the first integrated circuit die, the second integrated circuit die, the internal package, and the chip interconnects.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a package substrate, having a component side and a system side;
mounting an integrated circuit die on the component side of the package substrate;
mounting a yet another integrated circuit die on the package substrate, the yet another integrated circuit die having the same size as the another integrated circuit die;
mounting an another integrated circuit die on the component side of the package substrate over the yet another integrated circuit die;
mounting an internal package with a wire in film adhesive over the integrated circuit die horizontally adjacent the another integrated circuit die, the internal package having an internal die, an internal package body, an internal package substrate having internal package contacts, and a further integrated circuit die on the internal package contacts, the internal package substrate coupled to the integrated circuit die, the another integrated circuit die, the further integrated circuit die, the internal die, the component side, or a combination thereof;
coupling a chip interconnect directly connected to the another integrated circuit die and the internal package;
coupling another chip interconnect directly connected to the internal package and the package substrate; and
forming a stacked package body by fully encapsulating the component side, the integrated circuit die, the another integrated circuit die, the internal package, the chip interconnect, and the internal package contacts.
2. The method as claimed in claim 1 wherein mounting the internal package includes:
fabricating the internal package substrate for mounting the internal die; and
molding the internal package body on the internal die and the internal package substrate.
3. The method as claimed in claim 1 further comprising forming a gap, on the component side, by mounting the another integrated circuit die spaced away from the integrated circuit die.
4. The method as claimed in claim 1 wherein:
mounting the internal package includes mounting the further integrated circuit die to the package substrate; and
mounting the another integrated circuit die includes mounting the another integrated circuit die over the further integrated circuit die.
5. A method of manufacture of an integrated circuit packaging system comprising:
providing a package substrate, having a component side with component contacts and a system side with system contacts;
forming system interconnects on the system contacts including forming a signal connection between the system interconnects and the component contacts on the component side;
mounting an integrated circuit die on the component side of the package substrate including applying an adhesive or a sealant between the component side and the integrated circuit die;
mounting a yet another integrated circuit die on the package substrate, the yet another integrated circuit die having the same size as the another integrated circuit die;
mounting an another integrated circuit die on the component side of the package substrate over the yet another integrated circuit die;
mounting an internal package with a wire in film adhesive over the integrated circuit die horizontally adjacent the another integrated circuit die, the internal package having an internal die, an internal package body, an internal package substrate having internal package contacts, and a further integrated circuit die on the internal package contacts, the internal package substrate coupled to the integrated circuit die, the another integrated circuit die, the further integrated circuit die, the internal die, the component side, or a combination thereof, the internal package contacts on a side of the internal package exposed from the internal package body and opposite of the integrated circuit die including applying a wire in film adhesive or the adhesive between the internal package and the integrated circuit die;
coupling a chip interconnect directly connected to the another integrated circuit die and the internal package;
coupling another chip interconnect directly connected to the internal package and the package substrate; and
forming a stacked package body by fully encapsulating the component side, the integrated circuit die, the another integrated circuit die, the internal package, the chip interconnects and the internal package contacts.
6. The method as claimed in claim 5 wherein mounting the internal package includes:
fabricating the internal package substrate for mounting the internal die including forming the internal package contacts through the internal package substrate; and
molding the internal package body on the internal die and the internal package substrate.
7. The method as claimed in claim 5 further comprising forming a gap, on the component side, by mounting the another integrated circuit die spaced away from the integrated circuit die and forming a gap contact in the gap.
8. The method as claimed in claim 5 wherein:
mounting the internal package includes mounting the further integrated circuit die to the package substrate; and
the another integrated circuit die is a wire bond die coupled to the component contacts, the internal package, the integrated circuit die, the further integrated circuit die, or a combination thereof.
9. An integrated circuit packaging system comprising:
a package substrate, having a component side and a system side;
an integrated circuit die mounted on the component side of the package substrate;
an another integrated circuit die mounted over the component side of the package substrate;
a yet another integrated circuit die under the another integrated circuit die, the yet another integrated circuit die having the same size as the another integrated circuit die;
a wire in film adhesive on the integrated circuit die;
an internal package mounted with the wire in film adhesive over the integrated circuit die horizontally adjacent the another integrated circuit die, the internal package having an internal die, an internal package body, an internal package substrate having internal package contacts, and a further integrated circuit die on the internal package contacts, the internal package substrate coupled to the integrated circuit die, the another integrated circuit die, the further integrated circuit die, the internal die, the component side, or a combination thereof;
a chip interconnect directly connected to the another integrated circuit die and the internal package;
another chip interconnect directly connected to the internal package and the package substrate; and
a stacked package body fully encapsulating the component side, the integrated circuit die, the another integrated circuit die, the internal package, the chip interconnect, and the internal package contacts.
10. The system as claimed in claim 9 wherein the internal package mounted includes:
the internal package body molded on the internal die and the internal package substrate.
11. The system as claimed in claim 9 wherein:
the integrated circuit die is on the component side; and
the another integrated circuit die is positioned with a gap therebetween.
12. The system as claimed in claim 9 wherein:
the further integrated circuit die is mounted to the package substrate; and
the another integrated circuit die is over the further integrated circuit die.
13. The system as claimed in claim 9 wherein:
the package substrate includes component contacts on the component side and system contacts on the system side; and
further comprising:
system interconnects on the system contacts coupled to the component contacts; and
an adhesive or a sealant between the integrated circuit die and the component side.
14. The system as claimed in claim 13 wherein the internal package mounted includes:
the internal package contacts through the internal package substrate; and
the internal package body molded on the internal die and the internal package substrate.
15. The system as claimed in claim 13 wherein the integrated circuit die, on the component side, and the another integrated circuit die are positioned with a gap therebetween includes a gap contact in the gap.
16. The system as claimed in claim 13 wherein:
the another integrated circuit die is a wire bond die coupled to the component contacts, the internal package, the integrated circuit die, the further integrated circuit die, or a combination thereof.