Integrated circuit package stacking system with redistribution and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit package stacking system including: forming a base frame includes: providing a support panel, and forming a coupling pad, a mounting pad, a base frame trace, a discrete component pad, or a combination thereof on the support panel; fabricating a package substrate; coupling an integrated circuit die to the package substrate; mounting the base frame over the integrated circuit die and the package substrate; and removing the support panel from the base frame.
1. An integrated circuit package stacking system comprising:
a first package having:
a first substrate;
a first integrated circuit die coupled to the first substrate;
a molded package body on the first integrated circuit die;
a planar surface over the first integrated circuit die and the first substrate, the planar surface formed of the molded package body including a mounting pad, a coupling pad, and a base frame trace, a discrete component pad in the base frame trace, or a combination thereof exposed from within the molded package body;
a plurality of system interconnects mounted on the planar surface;
a second package having:
a second substrate having top contacts and bottom contacts connected by through vias;
a second integrated circuit die coupled to the top contacts of the second substrate;
wherein the second substrate is mounted over and coupled to the plurality of system interconnects; and
a third integrated circuit die electrically connected to the first integrated circuit die, the second integrated circuit die, and the system interconnects through the mounting pad, the base frame trace, the coupling pad, a conductive post, or a combination thereof in the first package, wherein an inactive side of the third integrated circuit die in direct contact with the bottom contacts of the second substrate.
2. The system as claimed in claim 1 further comprising a first adhesive between the first integrated circuit die and the first substrate, and a second adhesive between the planar surface and the third integrated circuit die.
3. The system as claimed in claim 1 wherein the molded package body is on the first substrate.
4. The system as claimed in claim 1 wherein the first package includes the conductive post on the first substrate or the first integrated circuit die.
5. An integrated circuit package stacking system comprising:
a first package having:
a first substrate;
a first integrated circuit die coupled to the first substrate;
a molded package body on the first integrated circuit die;
a planar surface over the first integrated circuit die and the first substrate, the planar surface formed of the molded package body including a mounting pad, a coupling pad, and a base frame trace, a discrete component pad in the base frame trace, or a combination thereof exposed from within the molded package body;
a plurality of system interconnects mounted on the planar surface;
a second package having:
a second substrate having top contacts and bottom contacts connected by through vias;
a second integrated circuit die coupled to the top contacts of the second substrate;
wherein the second substrate is mounted over and coupled to the plurality of system interconnects;
a third integrated circuit die electrically connected to the first integrated circuit die, the second integrated circuit die, and the system interconnects through the mounting pad, the base frame trace, the coupling pad, a conductive post, or a combination thereof in the first package, wherein an inactive side of the third integrated circuit die in direct contact with the bottom contacts of the second substrate;
contact pads and system contact pads on the first substrate;
chip interconnects coupled between the first integrated circuit die and the contact pads of the first substrate; and
wherein:
the coupling pad, the mounting pad, the base frame trace, the discrete component pad, or a combination thereof includes a conductive material patterned and suspended over the first integrated circuit die.
6. The system as claimed in claim 5 further comprising a first adhesive between the first integrated circuit die and the first substrate, and a second adhesive between the planar surface and the third integrated circuit die.
7. The system as claimed in claim 5 wherein the molded package body on the first substrate includes an epoxy molding compound on the first substrate, the first integrated circuit die, the chip interconnects, the conductive post, the coupling pads, the mounting pads, and the base frame traces, the discrete component pads, or a combination thereof.
8. The system as claimed in claim 5 wherein the first package includes the conductive post on the first substrate or the first integrated circuit die, to provide an electrical connection to the coupling pad the mounting pad, the base frame trace, the discrete component pad, or the combination thereof.
9. The system as claimed in claim 5 wherein the third integrated circuit die is electrically connected to the coupling pad, the mounting pad, or a combination thereof.