Integrated circuit packaging system with package-on-package and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a substrate;

mounting a component over a side of the substrate;

forming an interface module having a module via in any location for connectivity to the substrate; and

mounting the entirety of the interface module over a portion of the side of the substrate next to the component; and

molding an encapsulation over the substrate with the encapsulation having the interface module embedded therein, the encapsulation having a recess exposing the interface module.

2. The method as claimed in claim 1 wherein mounting the interface module includes connecting the interface module to the substrate.

3. The method as claimed in claim 1 further comprising mounting an additional interface module adjacent the component.

4. The method as claimed in claim 1 further comprising connecting a stack component to the interface module.

5. A method of manufacture of an integrated circuit packaging system comprising:

providing a substrate;

mounting a component over a side of the substrate;

forming an interface module having a module via in any location for connectivity to the substrate;

mounting the entirety of the interface module over a portion of the side of the substrate next to the component;

molding an encapsulation over the substrate with the encapsulation having the interface module embedded therein, the encapsulation having a recess exposing the interface module; and

mounting a stack component over the interface module and connected to the substrate by the interface module.

6. The method as claimed in claim 5 wherein mounting the stack component over the interface module includes attaching a module-to-package interconnect.

7. The method as claimed in claim 5 wherein forming the interface module includes forming the interface module having a through-silicon via.

8. The method as claimed in claim 5 wherein mounting the interface module includes forming the interface module with silicon.

9. The method as claimed in claim 5 wherein:

forming the interface module includes forming the interface module having an outer side; and

molding the encapsulation includes molding the encapsulation having a top portion above the outer side.

10. An integrated circuit packaging system comprising:

a substrate;

a component over a side of the substrate;

an interface module having a module via in any location for connectivity to the substrate, the entirety of the interface module over a portion of the side of the substrate next to the component; and

an encapsulation over the substrate with the encapsulation having the interface module embedded therein, the encapsulation having a recess exposing the interface module.

11. The system as claimed in claim 10 wherein the interface module is connected to the substrate.

12. The system as claimed in claim 10 further comprising an additional interface module adjacent the component.

13. The system as claimed in claim 10 further comprising a stack component connected to the interface module.

14. The system as claimed in claim 10 further comprising a stack component over the interface module and connected to the substrate by the interface module.

15. The system as claimed in claim 14 wherein the stack component over the interface module includes a module-to-package interconnect.

16. The system as claimed in claim 14 wherein the interface module includes a through-silicon via.

17. The system as claimed in claim 14 wherein the interface module is formed with silicon.

18. The system as claimed in claim 14 wherein:

the interface module includes an outer side; and

the encapsulation includes a top portion above the outer side.