Ultra thin bumped wafer with under-film
View Patent ↗A method of making a semiconductor device includes forming an under-film layer over bumps disposed on a surface of a wafer to completely cover the bumps, and forming an adhesive layer over the under-film layer. The method further includes attaching a support layer over the adhesive layer, removing a portion of a back surface of the wafer, and removing the support layer to expose the adhesive layer that remains disposed over the under-film layer. The method further includes removing the adhesive layer to expose the under-film layer while the bumps remain completely covered by the under-film layer, and singulating the wafer to form a semiconductor die. The method further includes pressing the bumps into contact with a substrate while the under-film layer provides an underfill between the semiconductor die and the substrate.
1. A method of making a semiconductor device, comprising:
providing a wafer having a plurality of bumps formed on a surface of the wafer;
forming an under-film layer over the bumps formed on the surface of the wafer to completely cover all portions of the bumps with the under-film layer;
after forming the under-film layer, forming an adhesive layer over the under-film layer;
after forming the adhesive layer, attaching a support layer over the adhesive layer;
grinding a back surface of the wafer, wherein the support layer provides structural support to the wafer during the grinding process;
following the grinding process, laminating a dicing saw tape to the back surface of the wafer;
removing the support layer to expose the adhesive layer which remains disposed over the under-film layer; and
after removing the support layer, removing the adhesive layer to expose the under-film layer, wherein all portions of the bumps remain completely covered by the under-film layer after removing the adhesive layer.
2. The method of claim 1 , further comprising removing the dicing saw tape to singulate each of the plurality of semiconductor die.
3. The method of claim 1 , wherein grinding the back surface of the wafer removes between zero (0) and two (2) mils of material from the back surface of the wafer.
4. The method of claim 1 , wherein the adhesive layer comprises an ultraviolet (UV) tape.
5. The method of claim 1 , wherein the support layer comprises glass.
6. A method of making a semiconductor device, comprising:
forming an under-film layer over bumps formed on a surface of a wafer to completely cover all portions of the bumps with the under-film layer;
after forming the under-film layer, forming an adhesive layer over the under-film layer;
after forming the adhesive layer, attaching a support layer containing glass, acryl board, or wafer material over the adhesive layer;
removing a portion of a back surface of the wafer;
removing the support layer to expose the adhesive layer;
after removing the support layer, removing the adhesive layer to expose the under-film layer while all portions of the bumps remain completely covered by the under-film layer after removing the adhesive layer;
singulating the wafer to form a semiconductor die; and
using the under-film layer as an underfill between the semiconductor die and a substrate when mounting the semiconductor die to the substrate.
7. The method of claim 6 , further comprising applying dicing tape to the back surface of the wafer after removing the portion of the back surface of the wafer.
8. The method of claim 6 , further comprising removing up to two mils of the back surface of the wafer.
9. The method of claim 6 , wherein the adhesive layer comprises a thermoplastic resin.
10. The method of claim 6 , wherein the under-film layer comprises an epoxy material.
11. The method of claim 6 , further comprising forming the under-film layer by spin coating or screen printing.
12. A method of making a semiconductor device, comprising:
forming an under-film layer over bumps disposed on a surface of a wafer to completely cover the bumps;
forming an adhesive layer over the under-film layer;
attaching a support layer over the adhesive layer;
removing a portion of a back surface of the wafer;
removing the support layer to expose the adhesive layer which remains disposed over the under-film layer;
removing the adhesive layer to expose the under-film layer while the bumps remain completely covered by the under-film layer;
singulating the wafer to form a semiconductor die; and
pressing the bumps into contact with a substrate while the under-film layer provides an underfill between the semiconductor die and the substrate.
13. The method of claim 12 , further comprising applying dicing tape to the back surface of the wafer after removing the portion of the back surface of the wafer.
14. The method of claim 12 , further comprising removing up to two mils of the back surface of the wafer.
15. The method of claim 12 , wherein the support layer comprises an acryl board material.
16. The method of claim 12 , wherein the adhesive layer comprises a photo-resist material.
17. The method of claim 12 , wherein the under-film layer comprises an acryl adhesive material.