Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure
A method of manufacturing a semiconductor device includes providing a substrate having a conductive bump formed over the substrate and a semiconductor die with an active surface oriented to the substrate. An encapsulant is deposited over the semiconductor die and the conductive bump, and the encapsulant is planarized to expose a back surface of the semiconductor die opposite the active surface while leaving the encapsulant covering the conductive bump. A channel is formed into the encapsulant to expose the conductive bump. The channel extends vertically from a surface of the encapsulant down through the encapsulant and into a portion of the conductive bump. The channel extends through the encapsulant horizontally along a length of the semiconductor die. A shielding layer is formed over the encapsulant and the back surface of the semiconductor die. The shielding layer includes a docking pin extending into the channel and into the portion of the conductive bump to electrically connect to the conductive bump and provide isolation from inter-device interference.
1. A method of manufacturing a semiconductor device, comprising:
providing a substrate having a conductive bump formed over the substrate and a semiconductor die with an active surface oriented to the substrate;
depositing an encapsulant over the semiconductor die and the conductive bump;
planarizing the encapsulant to expose a back surface of the semiconductor die opposite the active surface while leaving the encapsulant covering the conductive bump; and
forming a channel into the encapsulant to expose the conductive bump, the channel extending vertically from a surface of the encapsulant down through the encapsulant and into a portion of the conductive bump, the channel extending through the encapsulant horizontally along a length of the semiconductor die.
2. The method of claim 1 , further comprising forming a shielding layer over the encapsulant and the back surface of the semiconductor die, the shielding layer including a docking pin extending into the channel of the encapsulant and into the portion of the conductive bump to electrically connect to the conductive bump and provide isolation from inter-device interference.
3. The method of claim 2 , wherein the shielding layer directly contacts the encapsulant and the back surface of the semiconductor die.
4. The method of claim 1 , further comprising forming a chamfer area around the shielding layer.
5. The method of claim 1 , further comprising conformally applying the shielding layer over the encapsulant and semiconductor die and into the channel.
6. The method of claim 1 , further comprising forming the channel in the encapsulant using a saw blade, film assist molding, or laser ablation.
7. A method of manufacturing a semiconductor device, comprising:
providing a substrate having an interconnect structure formed over the substrate and a semiconductor component mounted to the substrate;
depositing an encapsulant over the semiconductor component and interconnect structure; and
forming a channel into the encapsulant to expose the interconnect structure, the channel extending vertically from a surface of the encapsulant down through the encapsulant and into a portion of the interconnect structure, the channel extending through the encapsulant horizontally along a length of the semiconductor component.
8. The method of claim 7 , further comprising forming a shielding layer over the encapsulant and the semiconductor component, the shielding layer including a docking pin extending into the portion of the interconnect structure to electrically connect to the interconnect structure and provide isolation from inter-device interference.
9. The method of claim 8 , further comprising depositing conductive paste in the channel prior to forming the shielding layer.
10. The method of claim 7 , further comprising forming a chamfer area around the shielding layer.
11. The method of claim 7 , wherein the interconnect structure comprises a conductive bump.
12. The method of claim 7 , wherein forming the shielding layer comprises conformally applying the shielding layer over the encapsulant and the semiconductor die and into the channel.
13. A method of manufacturing a semiconductor device, comprising:
depositing an encapsulant over an interconnect structure and over a semiconductor component, the interconnect structure and the semiconductor component disposed over a substrate;
forming a channel in the encapsulant to expose the interconnect structure, the channel extending vertically from a surface of the encapsulant down through the encapsulant to the interconnect structure, the channel extending through the encapsulant horizontally along a length of the semiconductor component; and
forming a shielding layer over the encapsulant, the shielding layer electrically connected to the interconnect structure.
14. The method of claim 13 , wherein the shielding layer extends into the channel of the encapsulant horizontally along the length of the semiconductor component.
15. The method of claim 13 , wherein the interconnect structure is electrically connected to a conductive layer within the substrate.
16. The method of claim 13 , wherein the interconnect structure comprises a conductive pillar.
17. The method of claim 13 , further comprising, after forming the channel in the encapsulant, depositing a conductive paste in the channel.
18. The method of claim 13 , further comprising forming a docking pin on the shielding layer which extends into the channel and electrically connects to the interconnect structure.
19. The method of claim 13 , wherein forming the shielding layer comprises conformally applying the shielding layer over the encapsulant and the semiconductor die and into the channel.
20. The method of claim 13 , further comprising distributing heat generated by the semiconductor component across the shielding layer.
21. A semiconductor device, comprising:
a substrate;
an interconnect structure disposed over the substrate;
a semiconductor component mounted to the substrate;
an encapsulant deposited over the semiconductor component and the interconnect structure;
a channel disposed in the encapsulant, the channel extending vertically from a surface of the encapsulant down to the interconnect structure, the channel extending horizontally along a length of the semiconductor component; and
a shielding layer disposed over the encapsulant and semiconductor component, the shielding layer electrically connected to the interconnect structure to provide isolation from inter-device interference.
22. The semiconductor device of claim 21 , wherein the shielding layer extends into the channel of the encapsulant horizontally along the length of the semiconductor component.
23. The semiconductor device of claim 21 , further comprising a conductive layer disposed in the substrate, the interconnect structure electrically connected to the conductive layer.
24. The semiconductor device of claim 21 , further comprising a chamfered area formed around a perimeter of the shielding layer.
25. The semiconductor device of claim 21 , wherein the interconnect structure comprises a stud bump or a micro bump.
26. The semiconductor device of claim 21 , further comprising a docking pin disposed on the shielding layer, the docking pin extending into the channel and electrically connecting to the interconnect structure.
27. The semiconductor device of claim 21 , wherein the shielding layer is conformally applied over the encapsulant and semiconductor die and into the channel.