Shielded stacked integrated circuit packaging system and method of manufacture thereof

1. A method of manufacture of a shielded stacked integrated circuit packaging system comprising:

forming a first integrated circuit structure having a first substrate and a first integrated circuit die;

mounting a shield over the first substrate and the first integrated circuit die, the shield having a horizontal portion with a recess;

mounting a second integated circuit structure with a support in direct contact with both a side of a second substrate of the second integrated circuit structure and a facing side of a non-recessed portion of the horizontal portion, a second integrated circuit die of the second integrated circuit structure and the second substrate over the shield; and

forming a package encapsulation for covering the first integrated circuit die, the shield, and the second integrated circuit structure.

2. The method as claimed in claim 1 further comprising forming the shield includes forming the horizontal portion having a first vertical portion extended below the horizontal portion and the recess therein.

3. The method as claimed in claim 1 wherein mounting the second integrated circuit structure includes placing the second integrated circuit die partially in the recess.

4. A method of manufacture of a shielded stacked integrated circuit packaging system comprising:

forming a first integrated circuit structure having a first substrate and a first integrated circuit die attached on the first substrate;

mounting a shield on the first substrate with an adhesive and over the first integrated circuit die, the shield having a horizontal portion with a recess;

mounting a second integrated circuit structure with a support in direct contact with both a side of a second substrate of the second integrated circuit structure and a facing side of a non-recessed portion of the horizontal portion, a second integrated circuit die of the second integrated circuit structure attached on the second substrate, the second integrated circuit structure over the shield; and

forming a package encapsulation for covering the first integrated circuit die, the shield, the second integrated circuit structure, and a first device side of the first substrate.

5. The method as claimed in claim 4 further comprising attaching an external interconnect with a first non-device side of the first substrate.

6. The method as claimed in claim 4 further comprising connecting an external interconnect with a first non-device side of the first substrate and the shield for grounding.

7. The method as claimed in claim 4 further comprising forming the shield includes:

forming a first portion having a first vertical portion;

forming a second portion having a second vertical portion; and

attaching the first portion and the second portion.

8. The method as claimed in claim 4 further comprising forming the shield having a hole.

9. A shielded stacked integrated circuit packaging system comprising:

a first integrated circuit structure having a first substrate and a first integrated circuit die;

a shield over the first substrate and the first integrated circuit die, the shield having a horizontal portion with a recess;

a second integrated circuit structure having a second substrate and a second integrated circuit die over the shield;

a support in direct contact with both a side of the second substrate and a facing side of a non-recessed portion of the horizontal portion;

an internal interconnect between the first substrate and the second substrate; and

a package encapsulation for covering the first integrated circuit die, the shield, and the second integrated circuit structure.

10. The system as claimed in claim 9 wherein the shield includes the horizontal portion having a first vertical portion extended below the horizontal portion and the recess therein.

11. The system as claimed in claim 9 wherein the shield includes the second integrated circuit die partially in the recess.

12. The system as claimed in claim 9 wherein:

the first integrated circuit structure has the first substrate and the first integrated circuit die attached with the first substrate with a first adhesive;

the shield is attached to the first substrate with a second adhesive and over the first integrated circuit die;

the second integrated circuit structure has the second substrate and the second integrated circuit die over the shield with the second integrated circuit die attached to the second substrate with the first adhesive;

the internal interconnect is a bond wire between the first substrate and the second substrate; and

the package encapsulation is a cover for the first integrated circuit die, the shield, the second integrated circuit structure, and a first device side of the first substrate.

13. The system as claimed in claim 12 further comprising an external interconnect attached to a first non-device side of the first substrate.

14. The system as claimed in claim 12 further comprising an external interconnect connected with a first non-device side of the first substrate and the shield for grounding.

15. The system as claimed in claim 12 wherein the shield includes:

a first portion having a first vertical portion; and

a second portion, having a second vertical portion, is attached with the first portion.

16. The system as claimed in claim 12 wherein the shield includes a hole.