Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe
A semiconductor device has a vertically offset BOT interconnect structure. The vertical offset is achieved with a leadframe having a plurality of lead fingers around a die paddle. A first conductive layer is formed over the lead fingers. A second conductive layer is formed over the lead fingers. Each second conductive layer is positioned adjacent to the first conductive layer and each first conductive layer is positioned adjacent to the second conductive layer. The second conductive layer has a height greater than a height of the first conductive layer. The first and second conductive layers can have a side-by-side arrangement or staggered arrangement. Bumps are formed over the first and second conductive layers. Bond wires are electrically connected to the bumps. A semiconductor die is mounted over the die paddle of the leadframe and electrically connected to the bond wires and BOT interconnect structure.
1. A semiconductor device, comprising:
a substrate including a first lead finger and second lead finger adjacent to the first lead finger, the first lead finger and second lead finger comprising a surface disposed at a same level around a die area;
a semiconductor die disposed over the substrate;
a first conductive layer formed over the surface of the first lead finger;
a second conductive layer formed over the surface of the second lead finger, wherein a thickness of the second conductive layer is greater than a thickness of the first conductive layer;
a first bump formed over the first conductive layer at a first distance from the semiconductor die with a width of the first bump greater than a width of the first conductive layer; and
a second bump formed over the second conductive layer at a second distance from the semiconductor die with the second distance substantially equal to the first distance, the first bump overlaps the second bump and the first bump and the second bump are physically separated due to the thickness of the second conductive layer being greater than the thickness of the first conductive layer.
2. The semiconductor device of claim 1 , wherein a difference between the thickness of the first conductive layer and the thickness of the second conductive layer is about 20 micrometers.
3. The semiconductor device of claim 1 , further including a plurality of bond wires disposed between the first and second bumps and semiconductor die.
4. The semiconductor device of claim 1 , wherein the first lead finger and second lead finger extend under a footprint of the semiconductor die.
5. A semiconductor device, comprising:
a substrate including a first lead finger and second lead finger, wherein a height of the second lead finger is greater than a height of the first lead finger;
a first interconnect structure formed over the first lead finger with a width of the first interconnect structure greater than a width of the first lead finger; and
a second interconnect structure formed over the second lead finger with the second interconnect structure and the first interconnect structure aligned with respect to an edge of the semiconductor device and the first interconnect structure overlapping the second interconnect structure.
6. The semiconductor device of claim 5 , wherein the first interconnect structure includes a bump, stud bump, conductive pillar, or conductive post.
7. The semiconductor device of claim 5 , wherein a difference between the height of the first lead finger and the height of the second lead finger is about 20 micrometers.
8. The semiconductor device of claim 5 , wherein the first interconnect structure and second interconnect structure are staggered over the substrate.
9. The semiconductor device of claim 5 , further including a semiconductor die disposed over the substrate.
10. The semiconductor device of claim 9 , further including a plurality of bond wires disposed between the first and second interconnect structures and semiconductor die.
11. The semiconductor device of claim 9 , wherein a portion of the first lead finger and a portion of the second lead finger extend under a footprint of the semiconductor die.
12. A semiconductor device, comprising:
a substrate including a first lead finger and second lead finger vertically offset from the first lead finger;
a first interconnect structure formed over the first lead finger; and
a second interconnect structure formed over the second lead finger with the second interconnect structure overlapping the first interconnect structure.
13. The semiconductor device of claim 12 , wherein the first interconnect structure includes a bump, stud bump, conductive pillar, or conductive post.
14. The semiconductor device of claim 12 , wherein the vertical offset between the first lead finger and second lead finger is about 20 micrometers.
15. The semiconductor device of claim 12 , wherein the first interconnect structure and second interconnect structure are staggered over the substrate.
16. The semiconductor device of claim 12 , further including a semiconductor die disposed over the substrate.
17. The semiconductor device of claim 16 , further including a plurality of bond wires disposed between the first and second interconnect structures and semiconductor die.
18. A semiconductor device, comprising:
a substrate including a first lead finger and second lead finger of equal thicknesses;
a first conductive layer formed over the first lead finger;
a second conductive layer formed over the second lead finger, wherein a thickness of the second conductive layer is greater than a thickness of the first conductive layer; and
a first bump on trace (BOT) interconnect structure formed over the first lead finger and a second BOT interconnect structure formed over the second lead finger the first BOT interconnect structure overlaps the second BOT interconnect structure and the BOT interconnect structures are physically separated due to the thickness of the second conductive layer being greater than the thickness of the first conductive layer.
19. The semiconductor device of claim 18 , wherein the first BOT interconnect structure and second BOT interconnect structure overlap in plan view.
20. The semiconductor device of claim 18 , wherein the first BOT interconnect structure includes a bump, stud bump, conductive pillar, or conductive post.
21. The semiconductor device of claim 18 , wherein the first BOT interconnect structure and second BOT interconnect structure are staggered over the substrate.
22. The semiconductor device of claim 18 , further including a semiconductor die disposed over the substrate.
23. The semiconductor device of claim 22 , further including a plurality of bond wires disposed between the first BOT interconnect structure and semiconductor die.