IP Library Granted Patent US 9,590,165
Granted Patent B2
US 9,590,165 · App. 14/194,074 · Granted Mar 7, 2017

Acoustic resonator comprising aluminum scandium nitride and temperature compensation feature

Inventors: Qiang Zou (Fort Collins, CO); Chris Feng (Fort Collins, CO); Phil Nikkel (Loveland, CO); Kevin J. Grannen (Thornton, CO); Tangshiun Yeh (Fort Collins, CO); Dariusz Burak (Fort Collins, CO); John Choy (Westminster, CO); Tina L. Lamers (Fort Collins, CO)
Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
H01L41/0805H03H9/02102H03H9/131H03H9/173
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Quick Facts
Patent No.
US 9,590,165
App. No.
14/194,074
Granted
Mar 7, 2017
Kind
B2
Abstract

An acoustic resonator structure comprises a first electrode disposed on a substrate, a piezoelectric layer disposed on the first electrode and comprising aluminum scandium nitride, a second electrode disposed on the piezoelectric layer, and a temperature compensation feature having a temperature coefficient offsetting at least a portion of a temperature coefficient of the piezoelectric layer, the first electrode, and the second electrode.

Claims (33)

1. An acoustic resonator structure, comprising:

a first electrode disposed on a substrate;

a piezoelectric layer disposed on the first electrode and comprising aluminum scandium nitride;

a second electrode disposed on the piezoelectric layer; and

a temperature compensation feature having a temperature coefficient offsetting at least a portion of a temperature coefficient of the piezoelectric layer, the first electrode, or the second electrode; and

a planarization layer disposed over the substrate and abutting the first electrode, the planarization layer being substantially flush with the first electrode.

2. The acoustic resonator structure of claim 1 , wherein the aluminum scandium nitride comprises about 3-10 wt % scandium.

3. The acoustic resonator structure of claim 1 , wherein the temperature compensation feature comprises silicon oxide.

4. The acoustic resonator structure of claim 1 , wherein the temperature compensation feature comprises a temperature compensation layer disposed between the first electrode and the piezoelectric layer.

5. The acoustic resonator structure of claim 4 , further comprising an interposer layer formed over the temperature compensation layer and in contact with the first electrode.

6. The acoustic resonator structure of claim 1 , wherein the temperature compensation feature comprises a temperature compensation layer disposed on the second electrode.

7. The acoustic resonator structure of claim 6 , further comprising an interposer layer formed over the temperature compensation layer and in contact with the second electrode.

8. The acoustic resonator structure of claim 1 , wherein the temperature compensation feature comprises a temperature compensation layer embedded within the piezoelectric layer.

9. The acoustic resonator structure of claim 8 , further comprising a first interposer layer formed over the temperature compensation layer, and a second interposer layer formed under the temperature compensation layer.

10. The acoustic resonator structure of claim 1 , further comprising an air cavity disposed in the substrate, wherein the temperature compensation feature is disposed within a perimeter of the air cavity.

11. The acoustic resonator structure of claim 10 , wherein the temperature compensation feature has an edge located at a distance of about 0-2 microns from the perimeter of the air cavity.

12. The acoustic resonator structure of claim 1 , wherein the temperature coefficient of the temperature compensation feature is a positive temperature coefficient and the temperature coefficient of the piezoelectric layer, the first electrode, and the second electrode is a negative temperature coefficient.

13. An acoustic resonator structure, comprising:

a first electrode disposed on a substrate;

a piezoelectric layer disposed on the first electrode and comprising a piezoelectric material combined with at least one rare earth element;

a second electrode disposed on the piezoelectric layer;

a temperature compensation feature having a temperature coefficient offsetting at least a portion of a temperature coefficient of the piezoelectric layer, the first electrode, or the second electrode; and

a planarization layer disposed over the substrate and abutting the first electrode, the planarization layer being substantially flush with the first electrode.

14. The acoustic resonator structure of claim 13 , wherein the at least one rare earth element comprises scandium (Sc).

15. The acoustic resonator structure of claim 13 , wherein the at least one rare earth element comprises at least one of ytterbium (Yb), yttrium (Y), lanthanum (La), and erbium (Er).

16. The acoustic resonator structure of claim 13 , wherein the piezoelectric layer comprises about 3-10 wt % of the at least one rare earth element.

17. The acoustic resonator structure of claim 13 , wherein the temperature compensation feature comprises at least one of boron silicate glass (BSG), silicon dioxide (SiO 2 ), chromium (Cr) and tellurium oxide (TeO(x)).

18. The acoustic resonator structure of claim 13 , wherein the temperature compensation feature comprises a temperature compensation layer disposed between the first electrode and the piezoelectric layer.

19. The acoustic resonator structure of claim 13 , wherein the temperature compensation feature comprises a temperature compensation layer disposed on the second electrode.

20. The acoustic resonator structure of claim 13 , wherein the temperature compensation feature comprises a temperature compensation layer embedded within the piezoelectric layer.

21. The acoustic resonator structure of claim 1 , wherein the planarization layer is a first planarization layer, and the acoustic resonator structure further comprises a second planarization layer disposed over the piezoelectric layer and abutting the second electrode, the planarization layer being substantially flush with the second electrode.

22. The acoustic resonator structure of claim 1 , wherein ends of the temperature compensation feature are tapered.

23. The acoustic resonator structure of claim 13 , wherein the planarization layer is a first planarization layer, and the acoustic resonator structure further comprises a second planarization layer disposed over the piezoelectric layer and abutting the second electrode, the planarization layer being substantially flush with the second electrode.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 047422 FRAME: 0464. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048883/0702 →
MERGER Recorded Oct 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047422/0464 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 28, 2014
From: ZOU, QIANG; FENG, CHRIS; NIKKEL, PHIL; GRANNEN, KEVIN J.; YEH, TANGSHIUN; BURAK, DARIUSZ; CHOY, JOHN; LAMERS, TINA L.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 032327/0596 →
Continuity (12)
Continuation In Part 14092026 · Nov 27, 2013
Continuation In Part 14092793 · Nov 27, 2013
Continuation In Part 14092077 · Nov 27, 2013
Continuation In Part 13955774 · Jul 31, 2013
Continuation In Part 13781491 · Feb 28, 2013
Continuation In Part 13663449 · Oct 29, 2012
Continuation In Part 13208883 · Aug 12, 2011
Continuation In Part 13074262 · Mar 29, 2011
Continuation In Part 13766993 · Feb 14, 2013
Continuation In Part 13660941 · Oct 25, 2012
Continuation In Part 13767754 · Feb 14, 2013
Related Publication 20140175950A1 · Jun 26, 2014