IP Library Granted Patent US 12,321,203
Granted Patent B2
US 12,321,203 · App. 16/947,327 · Granted Jun 3, 2025

Base assemblies for knob on display devices and related systems, methods, and devices

Inventor: Nigel Hinson (Lymington, GB)
Assignee: Atmel Corporation
G06F1/169G05G9/047G06F3/0354G06F3/0362G06F3/0412G06F3/0414G05G2009/0474G05G2009/04766G06F2203/04103G06F2203/04106
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Quick Facts
Patent No.
US 12,321,203
App. No.
16/947,327
Granted
Jun 3, 2025
Kind
B2
Abstract

Knob on display (KoD) devices and related systems, methods, and devices are disclosed. A KoD device includes at least one electrode including an electrically conductive material. The KoD device also includes a base assembly configured to be positioned between a touch screen of a touch screen device and the at least one electrode. The at least one electrode is configured to be positioned in engagement proximity to a touch sensor of the touch screen device through the base assembly.

Claims (36)

1. A knob on display (KoD) device, comprising:

at least one electrode comprising an electrically conductive material, the at least one electrode to be positioned in engagement proximity to a touch screen of a touch screen device responsive to placement of the KoD device on the touch screen;

a dome switch electrically connecting the at least one electrode to a touch surface of the KoD device; and

a base assembly to be positioned between the touch screen of the touch screen device and a face of the at least one electrode that faces the touch screen responsive to the placement of the KoD device on the touch screen, the at least one electrode to be positioned in engagement proximity to the touch screen of the touch screen device through the base assembly, the base assembly physically separating the face of the at least one electrode that faces the touch screen from the touch screen.

2. The KoD device of claim 1 , further comprising an adhesive applied to a side of the base assembly that is opposite to the at least one electrode to secure the KoD device to the touch screen of the touch screen device.

3. The KoD device of claim 2 , wherein the adhesive is applied to at least substantially the entire side of the base assembly that is opposite to the at least one electrode such that the adhesive is the same size as the entire side of the base assembly that is opposite to the at least one electrode.

4. The KoD device of claim 1 , wherein the base assembly is configured to at least partially cover an end of the KoD device.

5. The KoD device of claim 1 , wherein the base assembly exhibits a thickness of 0.5 millimeters or less.

6. The KoD device of claim 1 , wherein the base assembly includes one or more side walls extending toward a conductive cap of the KoD device.

7. The KoD device of claim 6 , further comprising one or more seals between the one or more side walls of the base assembly and the conductive cap of the KoD device.

8. The KoD device of claim 1 , wherein the at least one electrode includes a rotation electrode pad configured to rotate within the engagement proximity of a touch sensor responsive to a rotation of a conductive cap of the KoD device.

9. The KoD device of claim 1 , further comprising:

an inner housing coupled to the at least one electrode; and

a bearing coupled to the inner housing;

wherein the base assembly comprises a post coupled to the bearing to enable the inner housing and the at least one electrode to rotate about the post.

10. The KoD device of claim 9 , wherein the base assembly comprises detents and the inner housing includes one or more detent actuators to provide mechanical resistance to rotation of the inner housing about the post.

11. A knob on display (KoD) system, comprising:

a touch screen device comprising a touch sensor and a touch screen; and

a KoD device including:

a base assembly secured to the touch screen of the touch screen device;

one or more electrodes positioned in engagement proximity to the touch sensor of the touch screen device through the base assembly, the base assembly physically separating the one or more electrodes from the touch screen; and

a dome switch electrically connecting the one or more electrodes to a touch surface of the KoD device.

12. The KoD system of claim 11 , wherein:

the base assembly includes a post extending therefrom; and

the KoD device further includes an inner housing coupled to the one or more electrodes, the base assembly configured to at least partially house the inner housing, the inner housing and the one or more electrodes configured to rotate about the post of the base assembly.

13. The KoD system of claim 11 , wherein the base assembly is secured to the touch screen using an adhesive.

14. The KoD system of claim 13 , wherein the adhesive spans at least substantially an entire surface of the base assembly that faces the touch screen.

15. The KoD system of claim 11 , wherein the touch surface is electrically connected, through the dome switch, to a push electrode pad of the one or more electrodes responsive to a first position of the KoD device, the touch surface electrically isolated from the push electrode pad responsive to a second position of the KoD device.

16. The KoD system of claim 15 , wherein the one or more electrodes include a rotation electrode pad electrically connected, through the dome switch, to the touch surface of the KoD device regardless of the first position of the KoD device and the second position of the KoD device.

17. The KoD system of claim 11 , wherein the one or more electrodes include a rotation electrode pad electrically connected, through the dome switch, to a touch surface of the KoD device regardless of a depressed position of the KoD device and a released position of the KoD device.

18. A method of assembling a knob on display (KoD) system, the method comprising:

electrically connecting one or more electrodes of a KoD device to a touch surface of the KoD device through a dome switch;

applying an adhesive to a base assembly of the KoD device, the base assembly at least partially housing the one or more electrodes; and

securing the KoD device to a touch screen of a touch screen device with the base assembly between the one or more electrodes and the touch screen and with the one or more electrodes positioned in engagement proximity to a touch sensor of the touch screen device through the base assembly.

19. The method of claim 18 , wherein applying the adhesive to the base assembly comprises applying the adhesive to substantially an entire surface of the base assembly that is configured to face the touch screen.

20. The method of claim 19 , wherein the one or more electrodes are positioned at a fixed distance from the touch sensor of the touch screen device.

Assignments (11)
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059357/0823 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0335 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059264/0384 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0238 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 058214/0380 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0625 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2021
From: ATMEL TECHNOLOGIES U.K. LIMITED
To: ATMEL CORPORATION
Reel/Frame 057119/0499 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2021
From: HINSON, NIGEL
To: ATMEL TECHNOLOGIES U.K. LIMITED
Reel/Frame 057119/0496 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
Continuity (3)
Provisional Application 62901383 · Sep 17, 2019
Provisional Application 62887657 · Aug 15, 2019
Related Publication 20210048846A1 · Feb 18, 2021
References Cited (89)
US 4158216A · Bigelow · 1979 [cited by applicant]
US 5936613A · Jaeger et al. · 1999 [cited by applicant]
US 7414205B1 · Heinrich et al. · 2008 [cited by applicant]
US 8199114B1 · Jaeger · 2012 [cited by examiner]
US 10866619B1 · Bushnell et al. · 2020 [cited by applicant]
US 10921913B1 · Fong et al. · 2021 [cited by applicant]
US 20040253931A1 · Bonnelykke et al. · 2004 [cited by applicant]
US 20100026532A1 · Shimizu et al. · 2010 [cited by applicant]
US 20100214262A1 · Ishizaki et al. · 2010 [cited by applicant]
US 20100252335A1 · Orsley · 2010 [cited by applicant]
US 20100265197A1 · Purdy et al. · 2010 [cited by applicant]
US 20110298721A1 · Eldridge · 2011 [cited by examiner]
US 20120063101A1 · Schwartz et al. · 2012 [cited by applicant]
US 20120306802A1 · McCracken · 2012 [cited by applicant]
US 20130093702A1 · Argiro · 2013 [cited by applicant]
US 20130220779A1 · Kerner et al. · 2013 [cited by applicant]
US 20140042004A1 · Tseng · 2014 [cited by applicant]
US 20140062684A1 · Casparian et al. · 2014 [cited by applicant]
US 20140260776A1 · Burleson · 2014 [cited by applicant]
US 20150109243A1 · Jun et al. · 2015 [cited by applicant]
US 20160064167A1 · Lyszus et al. · 2016 [cited by applicant]
US 20170052617A1 · Okuzumi · 2017 [cited by examiner]
US 20170095874A1 · Morimoto et al. · 2017 [cited by applicant]
US 20170102788A1 · Arceo · 2017 [cited by examiner]
US 20170364205A1 · Chang et al. · 2017 [cited by applicant]
US 20180024649A1 · Uno · 2018 [cited by applicant]
US 20180046267A1 · Kobayashi · 2018 [cited by applicant]
US 20180081452A1 · Min et al. · 2018 [cited by applicant]
US 20180181042A1 · Ooba · 2018 [cited by applicant]
US 20190025944A1 · Konishi et al. · 2019 [cited by applicant]
US 20190080864A1 · Sawada et al. · 2019 [cited by applicant]
US 20190108953A1 · Dooley · 2019 [cited by applicant]
US 20190204983A1 · Huner · 2019 [cited by examiner]
US 20190213363A1 · Sugiura et al. · 2019 [cited by applicant]
US 20190250740A1 · Okuzumi et al. · 2019 [cited by applicant]
US 20200073487A1 · Ballan · 2020 [cited by examiner]
US 20200073513A1 · Ballan et al. · 2020 [cited by applicant]
US 20200079217A1 · Shiue et al. · 2020 [cited by applicant]
US 20200225804A1 · Ikegami et al. · 2020 [cited by applicant]
US 20200278761A1 · Takaoka et al. · 2020 [cited by applicant]
US 20200301547A1 · Mori et al. · 2020 [cited by applicant]
US 20200319772A1 · Asai · 2020 [cited by applicant]
US 20210048845A1 · Hinson et al. · 2021 [cited by applicant]
US 20210064152A1 · Tanaka · 2021 [cited by applicant]
US 20210200337A1 · Takaoka et al. · 2021 [cited by applicant]
US 20210232269A1 · Sasaki et al. · 2021 [cited by applicant]
CA 2699363A1 · 2010 [cited by applicant]
CN 102402324A · 2012 [cited by applicant]
CN 103629706A · 2014 [cited by applicant]
CN 103937669A · 2014 [cited by applicant]
CN 205706187U · 2016 [cited by applicant]
CN 106462278A · 2017 [cited by applicant]
CN 107844205A · 2018 [cited by applicant]
CN 109192587A · 2019 [cited by applicant]
CN 109858297A · 2019 [cited by applicant]
DE 102017125827A1 · 2019 [cited by applicant]
EP 3144783A1 · 2017 [cited by applicant]
FR 3056474A1 · 2018 [cited by applicant]
JP 2001512858A · 2001 [cited by applicant]
JP 2008078022A · 2008 [cited by applicant]
JP 2009301854A · 2009 [cited by applicant]
JP 2013257807A · 2013 [cited by applicant]
JP 2015174092A · 2015 [cited by applicant]
JP 2018109833A · 2018 [cited by applicant]
JP 6419314B2 · 2018 [cited by applicant]
JP 6532631B1 · 2019 [cited by applicant]
WO 2010110532A2 · 2010 [cited by applicant]
WO 2010134947A1 · 2010 [cited by applicant]
WO 2016075907A1 · 2016 [cited by applicant]
WO 2018109833A1 · 2018 [cited by applicant]
WO 2018109835A1 · 2018 [cited by applicant]
WO 2018137944A1 · 2018 [cited by applicant]
International Search Report from International Application No. PCT/US2020/0070321, mailed Nov. 6, 2020, 5 pages. [cited by applicant]
International Written Opinion from International Application No. PCT/US2020/0070321, mailed Nov. 6, 2020, 8 pages. [cited by applicant]
Chinese First Office Action for Chinese Application No. 202080057323.8, dated Sep. 15, 2023, 58 pages with translation. [cited by applicant]
Chinese First Office Action for Chinese Application No. 202080057337.X, dated Sep. 22, 2023, 26 pages with translation. [cited by applicant]
Chinese Notification to Grant Patent Right for Invention and Search Report of Chinese Patent Application No. 202080057323.8, issued Feb. 21, 2024, 9 pages with English translation. [cited by applicant]
Chinese Notification to Grant Patent Right for Invention and Search Report of Chinese Patent Application No. 202080057337.X, issued Mar. 5, 2024, 9 pages with English translation. [cited by applicant]
Examination Notice for German Patent Application No. 11 2020 003 873.4, dated Nov. 20, 2023, 12 pages with translation. [cited by applicant]
Examination Notice for German Patent Application No. 11 2020 003 874.2, dated Nov. 17, 2023, 12 pages with translation. [cited by applicant]
German Examination Notice for German Patent Application No. 11 2020 003 873.4, mailed May 17, 2024, 6 pages with English machine translation. [cited by applicant]
Letter of Examination Report and Search Report of Taiwan Patent Application No. 109127646, issued Feb. 21, 2024, 14 pages with English translation. [cited by applicant]
Notice of Reasons for Refusal of Japanese Patent Application No. 2022-508497, issued Jul. 2, 2024, 12 pages with English translation. [cited by applicant]
Notice of Reasons for Refusal of Japanese Patent Application No. 2022-508498, issued Jul. 2, 2024, 7 pages with English translation. [cited by applicant]
Notification of Provisional Rejection of Korean Patent Application No. 10-2022-7006888, mailed Nov. 16, 2023, 12 pages with English translation. [cited by applicant]
Request for Submission of an Opinion for Korean Patent Application No. 10-2022-7006891, mailed Nov. 20, 2023, 15 pages with English translation. [cited by applicant]
Second Office Action and Search Report of Taiwan Patent Application No. 109127646, issued Jun. 25, 2024, 12 pages with English translation. [cited by applicant]
Taiwan Notice of Office Action and Search Report for Taiwan Patent Application No. 109127644, issued Oct. 30, 2023, 17 pages with English translation. [cited by applicant]
Notification of Reasons for Refusal of Japanese Patent Application No. 2022-508497, mailed Mar. 18, 2025, 4 pages with English translation. [cited by applicant]