IP Library Patent Application 60665208
Patent Application Provisional
App. No. 60/665,208 · Confirmation No. 1791

Flip chip interconnection having narrow interconnection sites on the substrate

Inventor: Rajendra D. Pendse
Provisional Application Expired
⬇ PDF
Code Description Pages PDF
2005-03-25 TRNA Transmittal of New Application 1 View
2005-03-25 SPEC Specification 17 View
2005-03-25 CLM Claims 1 View
2005-03-25 ABST Abstract 1 View
2005-03-25 DRW Drawings-only black and white line drawings 8 View
2005-03-25 WFEE Fee Worksheet (SB06) 1 View
2005-03-25 ADS Application Data Sheet 3 View
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Quick Facts
App. No.
60/665,208
Filed
2005-03-25