Patent Assignment
Reel/Frame 011736/0411
Assignment of Assignor's Interest
Recorded: 2001-04-20
Pages: 3
Assignors
GLENN, THOMAS P.
Executed: 2001-04-18
HOLLAWAY, ROY D.
Executed: 2001-04-17
WEBSTER, STEVEN
Executed: 2001-04-12
Assignee
AMKOR TECHNOLOGY, INC.
1900 S. PRICE ROAD, ARIZONA, CALIFORNIA, 85248
Covered Property
(1)
Vacuum Sealed Package for Semiconductor Chip
Patent:
6,528,875 →
Application:
09/839,305 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jul 6, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 014885/0691 →
Security Agreement
Nov 2, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS "AGENT"
Reel/Frame 015942/0521 →
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Termination & Release of Patent Security Agreement
Jan 3, 2006
From: CITICORP NORTH AMERICA, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 017388/0868 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →