IP Library Assignment 011789/0410
Patent Assignment
Reel/Frame 011789/0410

Assignment of Assignor's Interest

Recorded: 2001-05-08 Pages: 6
Assignors
UEDA, HIROTAKA
Executed: 2001-04-24
MIZUTANI, MASAKI
Executed: 2001-04-17
Assignees
AMKOR TECHNOLOGY, INC., A CORPORATION OF DELAWARE
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248
NITTO DENKO CORPORATION
A CORPORATION OF JAPAN, 1-1-2, SHIMOHOZUMI, IBARAKI-SHI, OSAKA, JAPAN
Covered Property (1)
Sheet Resin Composition
Patent: 6,620,862 →
Application: 09/851,564 →
Publication: US 2002/0001688
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Jul 6, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 014885/0691 →
Security Agreement Nov 2, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS "AGENT"
Reel/Frame 015942/0521 →
Security Agreement Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Termination & Release of Patent Security Agreement Jan 3, 2006
From: CITICORP NORTH AMERICA, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 017388/0868 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →