Patent Assignment
Reel/Frame 012431/0085
Assignment of Assignor's Interest
Recorded: 2002-01-07
Pages: 10
Assignors
GRABBE, ALEXIS
Executed: 2001-06-26
HALER, MICHELE L.
Executed: 2001-09-27
HULL, ASHLEY S.
Executed: 2001-09-26
BJELOPAVLIC, MICK
Executed: 2001-09-27
ZHANG, GUOQIANG (DAVID)
Executed: 2001-10-01
ERK, HENRY F.
Executed: 2001-10-15
XIN, YUN-BIAO
Executed: 2001-10-15
Assignee
MEMC ELECTRONIC MATERIALS, INC.
501 PEARL DRIVE, P.O. BOX 8, ST. PETERS, MISSOURI, 63376
Covered Property
(1)
Method and Apparatus for Processing a Semiconductor Wafer Using Novel Final Polishing Method
Related Assignments
(16)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Nov 21, 2001
From: MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.; MEMC SOUTHWEST INC.
To: CITICORP USA, INC.
Reel/Frame 012280/0161 →
Security Interest
Nov 21, 2001
From: MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.; MEMC SOUTHWEST INC.
To: CITICORP USA, INC.
Reel/Frame 012273/0145 →
Termination of Security Interest
Nov 21, 2001
From: E.ON AG
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 012263/0944 →
Security Interest
Dec 27, 2001
From: MEMC ELECTRONIC MATERIALS, INC.
To: E. ON AG
Reel/Frame 012407/0806 →
Security Agreement
Dec 28, 2001
From: MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.; MEMC SOUTHWEST INC.
To: CITICORP USA, INC.
Reel/Frame 012365/0345 →
Release of Security Interest
Aug 11, 2005
From: CITICORP USA, INC.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 016641/0045 →
Security Agreement
Apr 1, 2011
From: MEMC ELECTRONIC MATERIALS, INC.; SUNEDISON LLC; SOLAICX
To: BANK OF AMERICA, N.A.
Reel/Frame 026064/0720 →
Security Agreement
Oct 1, 2012
From: NVT, LLC; SUN EDISON LLC; SOLAICX, INC.; MEMC ELECTRONIC MATERIALS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 029057/0810 →
Release of Security Interest
Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
Release of Security Interest
Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
Security Agreement
Jan 30, 2014
From: SUNEDISON, INC.; SOLAICX; SUN EDISON, LLC; NVT, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 032177/0359 →
Release of Security Interest
Mar 3, 2014
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC.
Reel/Frame 032382/0724 →
Release of Security Interest to Reel/Frame: 012280/0161
Mar 17, 2014
From: CITICORP USA, INC.
To: MEMC ELECTRONIC MATERIALS, INC. (NOW KNOWN AS SUNEDISON, INC.); MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.
Reel/Frame 032458/0794 →
Assignment of Assignor's Interest
May 27, 2014
From: MEMC ELECTRONIC MATERIALS, INC.
To: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
Reel/Frame 033023/0430 →
Notice of License Agreement
Jun 6, 2014
From: SUNEDISON SEMICONDUCTOR LIMITED
To: SUNEDISON SEMICONDUCTOR TECHNOLOGY PTE. LTD.
Reel/Frame 033099/0001 →
Assignment of Assignor's Interest
Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →