IP Library Granted Patent US 6,709,981
Granted Patent Utility
US 6,709,981 · Confirmation No. 7155

METHOD AND APPARATUS FOR PROCESSING A SEMICONDUCTOR WAFER USING NOVEL FINAL POLISHING METHOD

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Code Description Pages PDF
2014-01-30 OATH Oath or Declaration filed 65 View
2013-12-26 OATH Oath or Declaration filed 29 View
2013-12-26 OATH Oath or Declaration filed 42 View
2008-05-30 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2008-05-30 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2008-05-21 PA.. Power of Attorney 3 View
2008-05-21 N417 Electronic Filing System Acknowledgment Receipt 2 View
2005-01-18 COCOUT Certificate of Correction - Post Issue Communication 1 View
2004-01-28 IFEE Issue Fee Payment (PTO-85B) 1 View
2004-01-28 LET. Miscellaneous Incoming Letter 2 View
2001-08-13 TRNA Transmittal of New Application 4 View
2001-08-13 ADS Application Data Sheet 2 View
2001-08-13 SPEC Specification 36 View
2001-08-13 CLM Claims 17 View
2001-08-13 ABST Abstract 1 View
2001-08-13 DRW Drawings-only black and white line drawings 7 View
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Quick Facts
Patent No.
US 6,709,981
App. No.
09/928,559
Filed
2001-08-13
Granted
2004-03-23
Pub. No.
US20020052064A1
Art Unit
2813
PTA
-97 days