IP Library › Assignment 013933/0385
Patent Assignment
Reel/Frame 013933/0385

Merger

Recorded: 2003-08-28 Pages: 14
Assignor
PLEXUS PROPERTY HOLDING CORP.
Executed: 2002-12-20
Assignee
PLEXUS SERVICES CORP.
2325-B RENAISSANCE DRIVE, LAS VEGAS, NEVADA, 89119
Covered Properties (45)
Vibrational Method of Aligning the Leads of Surface-Mount Electronic Components with the Mounting Pads of Printed Circuit Boards During the Molten Solder Mounting Process
Patent: 4,885,841 →
Application: 07/313,221 →
Semiconductor Pick-and-Place Machine Calibration Apparatus
Patent: 5,247,844 →
Application: 07/783,111 →
Semiconductor Pick-and-Place Machine Automatic Calibration Apparatus
Patent: 5,237,622 →
Application: 07/802,310 →
Purified GP120 Composition Retaining Natural Conformation
Application: 08/109,002 →
Method Employing an Elevating of Atmospheric Pressure During the Heating and/or Cooling Phases of Ball Grid Array (Bga) Soldering of an Ic Device to a Pcb
Patent: 5,385,291 →
Application: 08/179,396 →
Angled Pallets for Wave Soldering
Patent: 5,540,376 →
Application: 08/324,087 →
Automatic Optical Pick and Place Calibration and Capability Analysis System for Assembly of Components Onto Printed Circuit Boards
Patent: 5,537,204 →
Application: 08/408,081 →
Fixture for Alignment of Vacuum Nozzles on Semiconductor Manufacturing Equipment
Patent: 5,539,992 →
Application: 08/421,707 →
Shield and Method for Selective Wave Soldering
Patent: 5,617,990 →
Application: 08/498,670 →
Thermal Box for a Semiconductor Test System
Patent: 5,892,367 →
Application: 08/553,763 →
Actuator Stem and Actuator Design Having a D-Shaped Cross-Section
Patent: 5,755,471 →
Application: 08/602,346 →
Wave Solder Method for Attaching Components to a Printed Circuit Board
Patent: 5,775,568 →
Application: 08/686,781 →
Fixture for Testing and Prepping Light-Emitting Diodes
Patent: 5,793,220 →
Application: 08/695,613 →
Apparatus for Depositing Solder and Adhesive Materials Onto a Printed Circuit Board
Patent: 5,740,730 →
Application: 08/706,448 →
Universal Testing Device for Electronic Modules with Different Configurations and Operating Parameters
Patent: 5,757,201 →
Application: 08/712,371 →
Universal Fixture for Holding Printed Circuit Boards During Processing
Patent: 5,779,794 →
Application: 08/761,701 →
Apparatus for Preserving Solder Paste in the Manufacturing of Printed Circuit Board Assemblies
Patent: 5,876,498 →
Application: 08/772,155 →
Salvage Method and Apparatus for Recovering Microelectronic Components from Printed Circuit Boards
Patent: 5,927,591 →
Application: 08/775,644 →
Multiple Access Memory Device
Patent: 5,784,331 →
Application: 08/775,664 →
Air Bladder Fixture Tooling for Supporting Circuit Board Assembly Processing
Patent: 5,820,117 →
Application: 08/800,069 →
Shield and Method for Selective Wave Soldering
Patent: 5,704,535 →
Application: 08/801,996 →
Alignment Fixture for Solder-Wave Machines
Patent: 6,119,915 →
Application: 08/852,335 →
Module Handling Apparatus and Method with Rapid Switchover Capability
Patent: 5,931,311 →
Application: 08/891,954 →
Method of Attaching a Device to a Circuit Board
Patent: 6,610,430 →
Application: 08/896,412 →
Solder Paste Brick
Patent: 6,114,769 →
Application: 08/897,093 →
Method of Providing Electrical Contact to Component Leads
Patent: 5,874,323 →
Application: 08/919,536 →
Carrier Socket for Receiving a Damaged Ic
Patent: 5,910,024 →
Application: 08/919,626 →
Method for Preseriving Solder Paste in the Manufacturing of Printed Circuit Board Assemblies
Patent: 5,871,808 →
Application: 08/977,340 →
Universal Fixture for Holding Printed Circuit Boards During Processing
Patent: 6,113,693 →
Application: 09/001,533 →
Universal Fixture for Holding Printed Circuit Boards During Processing
Patent: 5,899,446 →
Application: 09/001,740 →
Universal Fixture for Holding Printed Circuit Boards During Processing
Patent: 6,069,322 →
Application: 09/002,234 →
Method for Calibrating a Pick and Place Machine Using a Glass Parts Pick-Up Jig
Patent: 6,050,151 →
Application: 09/009,626 →
Glass Parts Pick-Up Jig
Patent: 6,085,573 →
Application: 09/010,206 →
Real-Time Manufacturing Proces Control Monitoring Method
Patent: 6,115,643 →
Application: 09/018,076 →
Air Bladder Fixture Tooling for Supporting Circuit Board Assembly Processing
Patent: 5,906,364 →
Application: 09/021,791 →
Reflow Soldering Apparatus
Patent: 6,131,793 →
Application: 09/049,439 →
Calibration Jig for an Automated Placement Machine
Patent: 6,071,060 →
Application: 09/057,033 →
Method of Calibrating an Automated Placement Machine
Patent: 6,202,031 →
Application: 09/057,278 →
Method and Apparatus for Leveling the Upper Surface of a Pcb
Patent: 6,189,876 →
Application: 09/073,149 →
Non-Connected Drainage Channels for Selective Wave Solder Pallets
Patent: 6,145,729 →
Application: 09/099,278 →
Molded Selective Solder Pallet
Patent: 6,142,357 →
Application: 09/173,493 →
Interconnect Device and Method for Mating Dissimilar Electronic Package Footprints
Patent: 6,229,218 →
Application: 09/187,477 →
Device and Method for Attaching and Soldering Pre-Formed Solder Spheres to the Ball Grid Array (Bga) Integrated Circuit Package Attachment Sites in High Volume
Patent: 6,229,210 →
Application: 09/206,197 →
Method of Utilizing a Plasma Gas Mixture Containing Argon and CF4 to Clean and Coat a Conductor
Patent: 6,092,714 →
Application: 09/270,646 →
Molded selective solder pallet
Patent: 6,247,632 →
Application: 09/707,621 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Feb 21, 1989
From: MC NABB, JOHN P.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 005047/0247 →
Assignment of Assignors Interest. Jul 10, 1989
From: MC NABB, JOHN P.
To: MICRON TECHNOLOGY, INC., A CORP. OF DE
Reel/Frame 005161/0180 →
Assignment of Assignors Interest. Oct 25, 1991
From: HOWELL, DAVID A.
To: MICRON TECHNOLOGY, INC., A CORP.OF DE
Reel/Frame 005899/0668 →
Assignment of Assignors Interest. Dec 4, 1991
From: HOWELL, DAVID A.
To: MICRON TECHNOLOGY, INC. A CORP. OF DELAWARE
Reel/Frame 005937/0045 →
Security Interest Aug 21, 1992
From: REMINGTON PRODUCTS COMPANY
To: PROVIDENT BANK, THE
Reel/Frame 006241/0395 →
Assignment of Assignor's Interest Dec 20, 1993
From: MICRON TECHNOLOGY, INC.
To: MICRON SEMICONDUCTOR, INC.
Reel/Frame 006806/0257 →
Assignment of Assignor's Interest Jan 10, 1994
From: LATTA, RICHARD W.
To: MICRON CUSTOM MANUFACTURING SERVICES, INC.
Reel/Frame 006857/0739 →
Assignment of Assignor's Interest Aug 8, 1994
From: MICRON TECHNOLOGY, INC.
To: MICRON CUSTOM MANUFACTURING SERVICES, INC.
Reel/Frame 007091/0945 →
Assignment of Assignor's Interest Aug 8, 1994
From: MICRON TECHNOLOGY, INC.
To: MICRON CUSTOM MANUFACTURING SERVICES, INC.
Reel/Frame 007090/0693 →
Assignment of Assignor's Interest Aug 16, 1994
From: MICRON SEMICONDUCTOR, INC.
To: MICRON CUSTOM MANUFACTURING SERVIES, INC.
Reel/Frame 007103/0476 →
Assignment of Assignor's Interest Oct 14, 1994
From: ASLA, JESS; LANGE, ROY; DESPAIN, RON
To: MICRON CUSTOM MANUFACTURING SERVICES, INC.
Reel/Frame 007192/0071 →
Assignment of Assignor's Interest Mar 20, 1995
From: WOODHOUSE, GLENN P.
To: MICRON CUSTOM MANUFACTURING SERVICES, INC.
Reel/Frame 007393/0479 →
Assignment of Assignor's Interest Jul 3, 1995
From: THOMPSON, CURTIS C., SR.
To: MICRON ELECTRONICS, INC.
Reel/Frame 007574/0089 →
Assignment of Assignor's Interest Oct 23, 1995
From: MAGEE, ALLAN; CREED, ROBERT; LOISATE, STEVE
To: MICRON CUSTOM MANUFACTURING SERVICES, INC.
Reel/Frame 007729/0436 →
Merger and Change of Name Feb 29, 1996
From: MICRON CUSTOM MANUFACTURING SERVICES, INC.
To: MICRON ELECTRONICS, INC. A MINNESOTA CORP.
Reel/Frame 007980/0499 →
Merger and Change of Name Feb 29, 1996
From: MICRON CUSTOM MANUFACTURING SERVICES, INC.
To: MICRON ELECTRONICS, INC., A MN CORP.
Reel/Frame 007860/0298 →
Merger and Change of Name Feb 29, 1996
From: MICRON CUSTOM MANUFACTURING SERVICES, INC.
To: MICRON ELECTRONICS, INC., A MINNESOTA CORP.
Reel/Frame 007848/0603 →
Merger and Change of Name Feb 29, 1996
From: MICRON CUSTOM MANUFACTURING SERVICES, INC.
To: MICRON ELECTRONICS INC., A MN CORP.
Reel/Frame 007838/0238 →
Merger and Change of Name Feb 29, 1996
From: MICRON CUSTOM MANUFACTURING SERVICES, INC.
To: MICRON ELECTRONICS, INC., A MN CORP.
Reel/Frame 008240/0705 →
Assignment of Assignor's Interest May 1, 1996
From: BJORKLUND, JAMES M.; BANNER, BRYAN K.
To: MICRON ELECTRONICS, INC.
Reel/Frame 007918/0271 →
Assignment of Assignor's Interest Aug 12, 1996
From: THOMPSON, CURTIS C., SR.
To: MICRON ELECTRONICS, INC
Reel/Frame 008163/0849 →
Assignment of Assignor's Interest Sep 3, 1996
From: THOMPSON, CURTIS C., SR.
To: MICRON ELECTRONICS, INC.
Reel/Frame 008152/0034 →
Assignment of Assignor's Interest Sep 11, 1996
From: PARTRIDGE, FRANK E.; LOISATE, STEVE
To: MICRON ELECTRONICS, INC
Reel/Frame 008228/0990 →
Assignment of Assignor's Interest Dec 6, 1996
From: THOMPSON, CURTIS C.
To: MICRON ELECTRONICS, INC.
Reel/Frame 008351/0949 →
Assignment of Assignor's Interest Dec 20, 1996
From: THOMPSON, CURTIS C., SR.
To: MICRON ELECTRONICS, INC.
Reel/Frame 008374/0109 →