Patent Assignment
Reel/Frame 014855/0745
Assignment of Assignor's Interest
Recorded: 2004-07-15
Pages: 6
Assignors
JIN, YONGGANG
Executed: 2004-04-13
YONG, SHELLEY
Executed: 2004-04-13
CHUA, PUAY GEK
Executed: 2004-04-13
SHIN, WON SUN
Executed: 2004-04-15
Assignee
ST ASSEMBLY TEST SERVICES LTD.
5 YISHUN ST. 23, SINGAPORE 768442, SINGAPORE
Covered Property
(1)
System for Fabricating an Integrated Circuit Package on a Printed Circuit Board
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 6, 2015
From: ST ASSEMBLY TEST SERVICES LTD.
To: STATS CHIPPAC LTD.
Reel/Frame 036286/0590 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0400 →
Release of Security Interest
Dec 13, 2019
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 051285/0318 →
Assignment of Assignor's Interest
Dec 18, 2019
From: STATS CHIPPAC PTE. LTD.
To: JCET SEMICONDUCTOR (SHAOXING) CO., LTD.
Reel/Frame 051365/0680 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0400. Assignor(S) Hereby Confirms the Assignment.
Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064806/0593 →