System for fabricating an integrated circuit package on a printed circuit board

1. A method for reflow-soldering a part:

replacing air around an unsoldered part with a first inert gas;

removing the first inert gas to form a vacuum around the unsoldered part;

vacuum reflow soldering the unsoldered part to form a reflow-soldered part;

providing a second inert gas to fill the vacuum around the reflow-soldered part; and

replacing the second inert gas with air around the reflow-soldered part.

2. The method as claimed in claim 1 wherein:

the first and second inert gases are the same gas.

3. The method as claimed in claim 1 wherein:

vacuum reflow soldering comprises heating around an integrated circuit package on a printed circuit board having solder paste printed thereon at a plurality of different temperatures in the vacuum.

4. The method as claimed in claim 1 wherein:

removing the first inert gas includes simultaneously heating an integrated circuit package on a printed circuit board having solder paste printed thereon at a plurality of different temperatures; and

replacing the second inert gas includes simultaneously cooling the integrated circuit package on the printed circuit board having solder thereon at a plurality of different temperatures.

5. The method as claimed in claim 1 comprising:

moving an integrated circuit package on a printed circuit board in at least one direction of horizontally, vertically, and a combination thereof from replacing the air, removing the first inert gas, reflow soldering, providing the second inert gas, through replacing the second inert gas.

6. A method for reflow soldering an integrated circuit package on a printed circuit board comprising:

replacing air with a first inert gas around the integrated circuit package on the printed circuit board;

removing the first inert gas to form a vacuum around the integrated circuit package on the printed circuit board;

moving in a first move the integrated circuit package on the printed circuit board;

vacuum reflow soldering the integrated circuit package on the printed circuit board;

moving in a second move the integrated circuit package on the printed circuit board;

providing a second inert gas to fill the vacuum around the integrated circuit package on the printed circuit board;

replacing the second inert gas with air around the integrated circuit package on the printed circuit board;

moving in a third move the integrated circuit package on the printed circuit board; and

filling the vacuum with air, the first inert gas, or the second inert gas in respective first, second, or third moves after moving the integrated circuit package on the printed circuit board.

7. The method as claimed in claim 6 wherein:

vacuum reflow soldering provides the integrated circuit package on the printed circuit board having solder bumps with 90% of the solder bumps formed having less than 10% empty voids and 10% of the solder bumps having less than 20% empty voids as a percentage of volume.

8. The method as claimed in claim 6 wherein:

vacuum reflow soldering comprises heating around the integrated circuit package on the printed circuit board having solder paste printed thereon at a plurality of different temperatures in the vacuum.

9. The method as claimed in claim 6 wherein:

removing the first inert gas includes simultaneously heating the integrated circuit package on the printed circuit board having solder paste printed thereon at a plurality of different temperatures; and

replacing the second inert gas includes simultaneously cooling the integrated circuit package on the printed circuit board having solder thereon at a plurality of different temperatures in the unloading unit after moving the integrated circuit package on the printed circuit board in the first move.

10. The method as claimed in claim 6 comprising:

moving the integrated circuit package on the printed circuit board in at least one direction of horizontal, vertical, and a combination thereof.