Patent Assignment
Reel/Frame 014886/0752
Assignment of Assignor's Interest
Recorded: 2004-07-23
Pages: 6
Assignors
ZHAO, LUN
Executed: 2004-04-14
LOOI, WAN LAY
Executed: 2004-04-14
AUNG, KYAW OO
Executed: 2004-04-14
JIN, YONGGANG
Executed: 2004-04-14
SONG, JAE-YONG
Executed: 2004-04-14
SHIN, WON SUN
Executed: 2004-04-14
Assignee
ST ASSEMBLY TEST SERVICES LTD.
5 YISHUN ST. 23, SINGAPORE 768442, SINGAPORE
Covered Property
(1)
Method of Manufacturing Different Bond Pads on the Same Substrate of an Integrated Circuit Package
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 6, 2015
From: ST ASSEMBLY TEST SERVICES LTD.
To: STATS CHIPPAC LTD.
Reel/Frame 036286/0590 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0400 →
Release of Security Interest
Dec 13, 2019
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 051285/0318 →
Assignment of Assignor's Interest
Dec 18, 2019
From: STATS CHIPPAC PTE. LTD.
To: JCET SEMICONDUCTOR (SHAOXING) CO., LTD.
Reel/Frame 051365/0680 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0400. Assignor(S) Hereby Confirms the Assignment.
Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064806/0593 →