Patent Assignment
Reel/Frame 014926/0796
Change of Name
Recorded: 2004-07-30
Pages: 2
Assignor
CALDUS SEMICONDUCTOR, INC
Executed: 2003-11-25
Assignee
ZEUS SEMICONDUCTOR, INC.
600 SE ASSEMBLY AVENUE, SUITE 230, VANCOUVER, WASHINGTON, 98661
Covered Properties
(5)
Os Rectifying Schottky and Ohmic Junction and W/Wc/Tic Ohmic Contacts on Sic
Patent:
5,929,523 →
Application:
08/612,216 →
Method of Making Os and W/Wc/Tic Ohmic and Rectifying Contacts on Sic
Patent:
6,150,246 →
Application:
09/251,897 →
Adhesion and/or Encapsulation of Sililcon Carbide-Based Semiconductor Devices on Ceramic Substrates
Patent:
6,319,757 →
Application:
09/351,106 →
W/Wc/Tac Ohmic and Rectifying Contacts on Sic
Patent:
6,388,272 →
Application:
09/628,978 →
Adhesion and/or Encapsulation of Silicon Carbide-Based Semiconductor Devices on Ceramic Substrates
Related Assignments
(10)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Aug 20, 2001
From: 3C SEMICONDUCTOR CORPORATION
To: CALDUS SEMICONDUCTOR, INC.
Reel/Frame 012090/0819 →
Release of Security Interest
Aug 3, 2004
From: CASCADIA PACIFIC II, LLC
To: CALDUS SEMICONDUCTOR CORPORATION (AKA CALDUS SEMICONDUCTOR, INC.) NOW KNOWN AS ZEUS SEMICONDUCTOR, INC.
Reel/Frame 014943/0276 →
Assignment of Assignor's Interest
Sep 21, 2004
From: ZEUS SEMICONDUCTOR, INC., AN OREGON CORPORATION
To: ADVANCED POWER TECHNOLOGY, INC., A DELAWARE CORPORATION
Reel/Frame 015156/0553 →
Merger
May 12, 2006
From: ADVANCED POWER TECHNOLOGY, INC.
To: MICROSEMI CORP. - POWER PRODUCTS GROUP
Reel/Frame 017606/0501 →
Assignment of Assignor's Interest
Jun 14, 2007
From: MICROSEMI CORP. - POWER PRODUCTS GROUP
To: MICROSEMI CORPORATION
Reel/Frame 019419/0910 →
Patent Security Agreement
Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →
Notice of Succession of Agency
Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
Release of Security Interest
Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION
Reel/Frame 037558/0711 →
Patent Security Agreement
Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
Release of Security Interest
May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.
Reel/Frame 046251/0391 →