Patent Assignment
Reel/Frame 014943/0276
Release of Security Interest
Recorded: 2004-08-03
Pages: 3
Assignor
CASCADIA PACIFIC II, LLC
Executed: 2004-08-03
Assignee
CALDUS SEMICONDUCTOR CORPORATION (AKA CALDUS SEMICONDUCTOR, INC.) NOW KNOWN AS ZEUS SEMICONDUCTOR, INC.
SUITE 230, 600 SE ASSEMBLY AVENUE, VANCOUVER, WASHINGTON, 98661
Covered Properties
(6)
Substrates for the Growth of 3C-Silicon Carbide
Patent:
5,492,752 →
Application:
08/083,903 →
Os Rectifying Schottky and Ohmic Junction and W/Wc/Tic Ohmic Contacts on Sic
Patent:
5,929,523 →
Application:
08/612,216 →
Method of Making Os and W/Wc/Tic Ohmic and Rectifying Contacts on Sic
Patent:
6,150,246 →
Application:
09/251,897 →
Adhesion and/or Encapsulation of Sililcon Carbide-Based Semiconductor Devices on Ceramic Substrates
Patent:
6,319,757 →
Application:
09/351,106 →
W/Wc/Tac Ohmic and Rectifying Contacts on Sic
Patent:
6,388,272 →
Application:
09/628,978 →
Adhesion and/or Encapsulation of Silicon Carbide-Based Semiconductor Devices on Ceramic Substrates
Related Assignments
(10)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Aug 20, 2001
From: 3C SEMICONDUCTOR CORPORATION
To: CALDUS SEMICONDUCTOR, INC.
Reel/Frame 012090/0819 →
Change of Name
Jul 30, 2004
From: CALDUS SEMICONDUCTOR, INC
To: ZEUS SEMICONDUCTOR, INC.
Reel/Frame 014926/0796 →
Assignment of Assignor's Interest
Sep 21, 2004
From: ZEUS SEMICONDUCTOR, INC., AN OREGON CORPORATION
To: ADVANCED POWER TECHNOLOGY, INC., A DELAWARE CORPORATION
Reel/Frame 015156/0553 →
Merger
May 12, 2006
From: ADVANCED POWER TECHNOLOGY, INC.
To: MICROSEMI CORP. - POWER PRODUCTS GROUP
Reel/Frame 017606/0501 →
Assignment of Assignor's Interest
Jun 14, 2007
From: MICROSEMI CORP. - POWER PRODUCTS GROUP
To: MICROSEMI CORPORATION
Reel/Frame 019419/0910 →
Patent Security Agreement
Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →
Notice of Succession of Agency
Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
Release of Security Interest
Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION
Reel/Frame 037558/0711 →
Patent Security Agreement
Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
Release of Security Interest
May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.
Reel/Frame 046251/0391 →