IP Library › Assignment 019419/0910
Patent Assignment
Reel/Frame 019419/0910

Assignment of Assignor's Interest

Recorded: 2007-06-14 Pages: 5
Assignor
Assignee
MICROSEMI CORPORATION
405 SW COLUMBIA STREET, BEND, OREGON, 97702
Covered Properties (25)
Topographic Pattern Delineated Power Mosfet with Profile Tailored Recessed Source
Patent: 4,895,810 →
Application: 07/194,874 →
Topographic Pattern Delineated Power Mosfet with Profile Tailored Recessed Source
Patent: 5,045,903 →
Application: 07/439,101 →
Method of Making Topographic Pattern Delineated Power Mosfet with Profile Tailored Recessed Source
Patent: 5,019,522 →
Application: 07/460,258 →
Mask Surrogate Semiconductor Process Employing Dopant-Opaque Region
Patent: 5,089,434 →
Application: 07/467,947 →
Profile Tailored Trench Etch Using a SF6-O2 Etching Compositon Wherein Both Isotropic and Anisotropic Etching Is Achieved by Varying the Amount of Oxygen
Patent: 5,182,234 →
Application: 07/737,560 →
Mask Surrogate Semiconductor Process with Polysilicon Gate Protection
Patent: 5,256,583 →
Application: 07/817,867 →
Igbt Process to Produce Platinum Lifetime Control
Patent: 5,262,336 →
Application: 07/852,932 →
Semiconductor Device with Doped Electrical Breakdown Control Region
Patent: 5,231,474 →
Application: 07/917,524 →
High Density Power Device Fabrication Process
Patent: 5,283,201 →
Application: 07/927,169 →
Igbt Device with Platinum Lifetime Control Having Gradient or Profile Tailored Platinum Diffusion Regions
Patent: 5,283,202 →
Application: 07/945,817 →
Method for Controlling Electrical Breakdown in Semiconductor Power Devices
Patent: 5,434,095 →
Application: 08/030,797 →
Self-Aligned Power Mosfet Device with Recessed Gate and Source
Patent: 5,801,417 →
Application: 08/106,406 →
High Density Power Device Fabrication Process Using Undercut Oxide Sidewalls
Patent: 5,648,283 →
Application: 08/190,325 →
Igbt Device with Platinum Lifetime Control and Reduced Gain
Patent: 5,528,058 →
Application: 08/329,974 →
The Method of Making Substrates for the Growth of 3C-Silicon Carbide
Patent: 5,653,798 →
Application: 08/485,982 →
Os Rectifying Schottky and Ohmic Junction and W/Wc/Tic Ohmic Contacts on Sic
Patent: 5,929,523 →
Application: 08/612,216 →
Method of Making Os and W/Wc/Tic Ohmic and Rectifying Contacts on Sic
Patent: 6,150,246 →
Application: 09/251,897 →
Adhesion and/or Encapsulation of Sililcon Carbide-Based Semiconductor Devices on Ceramic Substrates
Patent: 6,319,757 →
Application: 09/351,106 →
W/Wc/Tac Ohmic and Rectifying Contacts on Sic
Patent: 6,388,272 →
Application: 09/628,978 →
Power Mos Device with Asymmetrical Channel Structure for Enhanced Linear Operation Capability
Patent: 6,503,786 →
Application: 09/925,289 →
Publication: US 2002/0020873
Adhesion and/or Encapsulation of Silicon Carbide-Based Semiconductor Devices on Ceramic Substrates
Patent: 6,911,714 →
Application: 10/016,578 →
Publication: US 2002/0066903
Power Mos Device with Asymmetrical Channel Structure for Enhanced Linear Operation Capability
Patent: 6,664,594 →
Application: 10/268,274 →
Publication: US 2003/0034522
Split-Gate Power Module and Method for Suppressing Oscillation Therein
Patent: 6,939,743 →
Application: 10/352,314 →
Publication: US 2003/0141587
Power Converter Method and Apparatus Having High Input Power Factor and Low Harmonic Distortion
Patent: 7,157,886 →
Application: 10/689,863 →
Publication: US 2004/0136208
Design and Fabrication of Rugged Fred
Patent: 7,169,634 →
Application: 10/757,028 →
Publication: US 2004/0164347
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name Aug 20, 2001
From: 3C SEMICONDUCTOR CORPORATION
To: CALDUS SEMICONDUCTOR, INC.
Reel/Frame 012090/0819 →
Assignment of Assignor's Interest Sep 29, 2003
From: FREY, RICHARD B.
To: ADVANCED POWER TECHNOLOGY, INC.
Reel/Frame 014535/0022 →
Change of Name Jul 30, 2004
From: CALDUS SEMICONDUCTOR, INC
To: ZEUS SEMICONDUCTOR, INC.
Reel/Frame 014926/0796 →
Release of Security Interest Aug 3, 2004
From: CASCADIA PACIFIC II, LLC
To: CALDUS SEMICONDUCTOR CORPORATION (AKA CALDUS SEMICONDUCTOR, INC.) NOW KNOWN AS ZEUS SEMICONDUCTOR, INC.
Reel/Frame 014943/0276 →
Assignment of Assignor's Interest Sep 21, 2004
From: ZEUS SEMICONDUCTOR, INC., AN OREGON CORPORATION
To: ADVANCED POWER TECHNOLOGY, INC., A DELAWARE CORPORATION
Reel/Frame 015156/0553 →
Asignment of Exclusive Paid Up License Sep 21, 2004
From: ZEUS SEMICONDUCTOR, INC.
To: ADVANCED POWER TECHNOLOGY, INC.
Reel/Frame 015156/0596 →
Merger May 12, 2006
From: ADVANCED POWER TECHNOLOGY, INC.
To: MICROSEMI CORP. - POWER PRODUCTS GROUP
Reel/Frame 017606/0501 →
Patent Security Agreement Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →
Supplemental Patent Security Agreement Nov 11, 2011
From: MICROSEMI CORPORATION; MICROSEMI CORP. - ANALOG MIXED SIGNAL GROUP; MICROSEMI CORP. - MASSACHUSETTS; ACTEL CORPORATION
To: MORGAN STANLEY & CO. LLC
Reel/Frame 027213/0611 →
Notice of Succession of Agency Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
Release of Security Interest Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION
Reel/Frame 037558/0711 →
Patent Security Agreement Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
Release of Security Interest May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.
Reel/Frame 046251/0391 →
Security Interest Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
Security Interest Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
Security Interest Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
Release of Security Interest May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 053466/0011 →
Security Interest Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
Security Interest Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
Security Interest Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
Release of Security Interest Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 059333/0222 →
Release of Security Interest Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 059358/0001 →
Release of Security Interest Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 059863/0400 →
Release of Security Interest Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 059363/0001 →
Release of Security Interest Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 060894/0437 →