Patent Assignment
Reel/Frame 015714/0442
Assignment of Assignor's Interest
Recorded: 2004-08-18
Pages: 2
Assignee
ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
1701 NORTH STREET, ENDICOTT, NEW YORK, 13760
Covered Property
(1)
Low Moisture Absorptive Circuitized Substrate, Method of Making Same, Electrical Assembly Utilizing Same, and Information Handling System Utilizing Same
Related Assignments
(16)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
May 10, 2005
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: WACHOVIA BANK, NATIONAL ASSOCIATION, AS AGENT
Reel/Frame 016561/0605 →
Assignment of Assignor's Interest
May 18, 2007
From: WACHOVIA BANK, NATIONAL ASSOCIATION, AS AGENT
To: WACHOVIA CAPITAL FINANCE CORPORATION ( NEW ENGLAND), AS AGENT
Reel/Frame 019304/0676 →
Release of Security Interest
Nov 20, 2008
From: WACHOVIA CAPITAL FINANCE CORPORATION
To: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
Reel/Frame 021861/0869 →
Security Agreement
Dec 3, 2008
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 021912/0908 →
Release by Secured Party
May 14, 2012
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
Reel/Frame 028230/0611 →
Security Agreement
May 14, 2012
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 028230/0798 →
Assignment of Security Agreement
Mar 6, 2013
From: PNC BANK, NATIONAL ASSOCIATION
To: INTEGRIAN HOLDINGS, LLC
Reel/Frame 029938/0823 →
Security Agreement
May 6, 2013
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.; INTEGRIAN HOLDINGS, LLC
To: M&T BANK
Reel/Frame 030359/0057 →
Security Agreement
Jun 12, 2013
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: MAINES, WILLIAM; MAINES, DAVID
Reel/Frame 030599/0918 →
Release of Security Interest
Feb 26, 2015
From: MAINES, WILLIAM; MAINES, DAVID
To: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
Reel/Frame 035098/0968 →
Assignment of Assignor's Interest
Apr 16, 2015
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: I3 ELECTRONICS, INC.
Reel/Frame 035442/0569 →
Security Interest
Nov 14, 2016
From: I3 ELECTRONICS, INC.
To: M&T BANK
Reel/Frame 040608/0626 →
Assignment of Assignor's Interest
Jul 15, 2019
From: I3 ELECTRONICS, INC.
To: TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 049758/0265 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →