Patent Assignment
Reel/Frame 018313/0588
Assignment of Assignor's Interest
Recorded: 2006-09-28
Pages: 10
Assignor
QED TECHNOLOGIES, INC.
Executed: 2006-07-07
Assignee
QED TECHNOLOGIES INTERNATIONAL, INC.
870 N. COMMONS DRIVE, LEGAL DEPARTMENT, AURORA, ILLINOIS, 60504
Covered Properties
(14)
System for Abrasive Jet Shaping and Polishing of a Surface Using Magnetorheological Fluid
Patent:
5,971,835 →
Application:
09/047,664 →
System for Magnetorheological Finishing of Substrates
Patent:
5,951,369 →
Application:
09/226,326 →
Magnetic Wiper
Patent:
6,267,651 →
Application:
09/480,306 →
Apparatus and Method for Abrasive Jet Finishing of Deeply Concave Surfaces Using Magnetorheological Fluid
Patent:
6,561,874 →
Application:
09/718,658 →
System for Magnetorheological Finishing of Substrates
Delivery System for Magnetorheological Fluid
Magnetic wiper
Jet-Induced Finishing of a Substrate Surface
Uniform Thin Films Produced by Magnetorheological Finishing
Method for Self-Calibrated Sub-Aperture Stitching for Surface Figure Measurement
Method for Calibrating the Geometry of a Multi-Axis Metrology System
Method and Apparatus for Measuring and Controlling Solids Composition of a Magnetorheological Fluid
Method and Apparatus for Forming a Dynamic Magnetic Seal Using Magnetorheological Fluid
Method for Accurate High-Resolution Measurements of Aspheric Surfaces
Related Assignments
(23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 25, 1998
From: KORDONSKI, WILLIAM I.; GOLINI, DONALD; HOGAN, STEPHEN; SEKERES, ARPAD
To: QED TECHNOLOGIES, INC.
Reel/Frame 009104/0700 →
Assignment of Assignor's Interest
Jan 6, 1999
From: KORDONSKI, WILLIAM L.; GOLINI, DONALD; HOGAN, STEPHEN; DUMAS, PAUL R.
To: QED TECHNOLOGIES, LLC
Reel/Frame 009695/0655 →
Assignment of Assignor's Interest
Jan 10, 2000
From: KORDONSKI, WILLIAM; GORODKIN GENNADI; HOGAN, STEPHEN; SEKERES, ARPAD
To: QED TECHNOLOGIES, INC.
Reel/Frame 010534/0351 →
Assignment of Assignor's Interest
Nov 22, 2000
From: KORDONSKI, WILLIAM I.
To: QED TECHNOLOGIES, LLC
Reel/Frame 011327/0649 →
Assignment of Assignor's Interest
Feb 1, 2001
From: KORDONSKI, WILLIAM; HOGAN, STEPHEN; CARAPELLA, JERRY; PRICE, ANDREW S.
To: QED TECHNOLOGIES, INC.
Reel/Frame 011520/0338 →
Assignment of Assignor's Interest
May 22, 2001
From: KORDONSKI, WILLIAM; HOGAN, STEPHEN; CARAPELLA, JERRY
To: QED TECHNOLOGIES, INC.
Reel/Frame 011840/0267 →
Assignment of Assignor's Interest
Jun 14, 2001
From: KORDONSKI, WILLIAM; GORODKIN, GENNADI; HOGAN, STEPHEN; SEKERES, ARPAD
To: QED TECHNOLOGIES, INC.
Reel/Frame 011913/0244 →
Assignment of Assignor's Interest
Jun 18, 2004
From: MURPHY, PAUL; FLEIG, JON; FORBES, GREG
To: QED TECHNOLOGIES, INC.
Reel/Frame 015477/0145 →
Assignment of Assignor's Interest
Aug 24, 2004
From: KORDONSKI, WILLIAM; NATKIN, MICHAEL; GORODKIN, SERGEI
To: QED TECHNOLOGIES, INC.
Reel/Frame 015717/0316 →
Assignment of Assignor's Interest
Feb 9, 2005
From: KORDONSKI, WILLIAM; SEKERES, ARPAD
To: QED TECHNOLOGIES, INC.
Reel/Frame 016237/0986 →
Assignment of Assignor's Interest
Feb 9, 2005
From: TRICARD, MARC; KORDONSKI, WILLIAM
To: QED TECHNOLOGIES, INC.
Reel/Frame 016237/0982 →
Assignment of Assignor's Interest
Apr 5, 2005
From: KORDONSKI, WILLIAM; PRICE, ANDY; CARAPELLA, JERRY; SEKERES, ARPAD
To: QED TECHNOLOGIES, INC.
Reel/Frame 016430/0088 →
Assignment of Assignor's Interest
Apr 25, 2006
From: GOLINI, DONALD; FORBES, GREG W.; MURPHY, PAUL E.
To: QED TECHNOLOGIES, INC.
Reel/Frame 017833/0360 →
Assignment of Assignor's Interest
Jun 6, 2006
From: MURPHY, PAUL E.; MILADINOVIC, DRAGISHA; FORBES, GREG W.; DEVRIES, GARY M.
To: QED TECHNOLOGIES, INC.
Reel/Frame 017974/0119 →
Notice of Security Interest in Patents
Feb 16, 2012
From: QED TECHNOLOGIES INTERNATIONAL, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 027727/0596 →
Security Agreement
Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
Release of Security Interest
Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.
Reel/Frame 047583/0028 →
Release of Security Interest
Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
Reel/Frame 060592/0260 →
Security Interest
Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
Security Interest
Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
Partial Release of Security Interest in Intellectual Property Recorded at Reel 060613, Frame 0072
Mar 1, 2023
From: TRUIST BANK, AS NOTES COLLATERAL AGENT
To: QED TECHNOLOGIES INTERNATIONAL, INC.
Reel/Frame 062901/0554 →
Security Interest
Mar 1, 2023
From: QED TECHNOLOGIES INTERNATIONAL, INC.
To: FIDUS INVESTMENT CORPORATION
Reel/Frame 062838/0648 →
Partial Release of Security Interest
Mar 1, 2023
From: MORGAN STANLEY SENIOR FUNDING, INC., AS AGENT
To: QED TECHNOLOGIES INTERNATIONAL, INC.
Reel/Frame 062904/0026 →