Patent Assignment
Reel/Frame 019365/0348
Assignment of Assignor's Interest
Recorded: 2007-06-01
Pages: 3
Assignor
FAB SOLUTIONS, INC.
Executed: 2007-05-21
Assignee
TOPCON CORPORATION
75-1 HASUNUMA-CHO, ITABASHI-KU, TOKYO, 174-8580, JAPAN
Covered Properties
(6)
Contact Hole Standard Test Device
Patent:
6,897,440 →
Application:
09/451,440 →
Surface Contamination Analyzer for Semiconductor Wafers, Method Used Therein and Process for Fabricating Semiconductor Device
Surface Contamination Analyzer for Semiconductor Wafers, Method Used Therein and Process for Fabricating Semiconductor Device
Contact Hole Standard Test Device, Method of Forming the Same, Method of Testing Contact Hole, Method and Apparatus for Measuring a Thickness of a Film, and Method of Testing a Wafer
Contact Hole Standard Test Device, Method of Forming the Same, Method of Testing Contact Hole, Method and Apparatus for Measuring a Thickness of a Film, and Method of Testing a Wafer
Contact Hole Standard Test Device, Method of Forming the Same, Method of Testing Contact Hole, Method and Apparatus for Measuring a Thickness of a Film, and Method of Testing a Wafer
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 30, 1999
From: YAMADA, KEIZO
To: NEC CORPORATION
Reel/Frame 010432/0602 →
Assignment of Assignor's Interest
Feb 26, 2002
From: USHIKI, TAKEO; YAMADA, KEIZO; ITAGAKI, YOHSUKE; TSUJIDE, TOHRU
To: NEC CORPORATION
Reel/Frame 012659/0895 →
Assignment of Assignor's Interest
Jan 2, 2003
From: NEC CORPORATION
To: FAB SOLUTIONS, INC.
Reel/Frame 013628/0427 →
Assignment of Assignor's Interest
Jan 9, 2003
From: NEC CORPORATION
To: FAB SOLUTIONS, INC.
Reel/Frame 013649/0294 →