Patent Assignment
Reel/Frame 022941/0129
Assignment of Assignor's Interest
Recorded: 2009-07-10
Pages: 7
Assignors
PAGAILA, REZA A.
Executed: 2009-06-19
DO, BYUNG TAI
Executed: 2009-06-19
HUANG, SHAUNGWU
Executed: 2009-06-19
PENDSE, RAJENDRA D.
Executed: 2009-07-09
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Vertical Interconnect Structure Using Stud Bumps
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 8, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038388/0036 →
Release of Security Interest
Jun 8, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052864/0057 →
Correct Error in Assignment Name from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. (Reel: 38388 Frame: 0036
Aug 31, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 064789/0885 →
Corrective Assignment to Correct a Typographical Error on the Cover Sheet Previously Recorded at Reel: 038388 Frame: 0036. Assignor(S) Hereby Confirms the Change of Name.
Sep 7, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064834/0911 →
Corrective Assignment to Correct a Typographical Error on the Cover Sheet Previously Recorded at Reel: 064789 Frame: 0885. Assignor(S) Hereby Confirms the Corrective Assignment.
Sep 7, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064836/0363 →