Patent Assignment
Reel/Frame 023419/0581
Change of Name
Recorded: 2009-10-26
Pages: 20
Assignor
INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC VZW)
Executed: 1984-01-16
Assignee
IMEC
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Properties
(6)
Non-Volatile Electrically Alterable Semiconductor Memory Device
Patent:
6,653,682 →
Application:
09/696,616 →
Method for Improving Mechanical Strength in Micro Electro Mechanical Systems and Devices Produced Thereof
Method for Producing Micromachined Devices and Devices Obtained Thereof
Single Bit Nonvolatile Memory Cell and Methods for Programming and Erasing Thereof
Electrostatic Discharge Protection Circuit
Method for Producing Patterned Thin Films
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Re-Record to Correct the Receiving Party's Name, Previously Recorded at Reel 011711, Frame 0158.
Sep 15, 2003
From: XUE, GANG; VAN HOUDT, JAN
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC, VZW)
Reel/Frame 014498/0086 →
Assignment of Assignor's Interest
May 21, 2004
From: WITVROUW, ANN; DE VRIES, ATZE-CEES; DE MOOR, PIET; HASPESLAGH, LUC
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC VZW); EASTMAN KODAK COMPANY
Reel/Frame 015349/0509 →
Assignment of Assignor's Interest
Jun 11, 2004
From: PARMENTIER, BRIGITTE
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC VZW); EASTMAN KODAK COMPANY
Reel/Frame 015451/0097 →
Confidentiality Agreement of Gang Xue and Imec
Jul 6, 2004
From: HOUDT, JAN VAN; XUE, GANG
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC); INFINEON AG, A GERMAN CORPORATION
Reel/Frame 015544/0954 →
Assignment of Assignor's Interest
Jul 6, 2004
From: VAN HOUDT, JAN; XUE, GANG
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC VZW); INFINEON AG
Reel/Frame 015531/0123 →
Assignment of Assignor's Interest
Sep 13, 2004
From: REYNDERS, KOEN; ZUBEIDAT, MAHMUD; DE HEYN, VINCENT
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC VZW); AMI SEMICONDUCTOR
Reel/Frame 015774/0889 →
Assignment of Assignor's Interest
Sep 20, 2004
From: HEREMANS, PAUL; JANSSEN, DIMITRI; STEUDEL, SOREN; VERLAAK, STIJN
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC VZW)
Reel/Frame 015794/0858 →
Security Agreement
Jun 23, 2008
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; AMIS HOLDINGS, INC.; AMI SEMICONDUCTOR, INC.; AMIS FOREIGN HOLDINGS INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 021138/0070 →
Change of Name
Dec 4, 2009
From: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC)
To: IMEC
Reel/Frame 023594/0846 →
Bill of Sale
Feb 1, 2010
From: AMI SEMICONDUCTOR, INC.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 023870/0698 →
Security Interest
Feb 21, 2012
From: EASTMAN KODAK COMPANY; PAKON, INC.
To: CITICORP NORTH AMERICA, INC., AS AGENT
Reel/Frame 028201/0420 →
Patent Security Agreement
Apr 1, 2013
From: EASTMAN KODAK COMPANY; PAKON, INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS AGENT
Reel/Frame 030122/0235 →
Intellectual Property Security Agreement (Abl)
Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.
To: BANK OF AMERICA N.A., AS AGENT
Reel/Frame 031162/0117 →
Release of Security Interest in Patents
Sep 5, 2013
From: CITICORP NORTH AMERICA, INC., AS SENIOR DIP AGENT; WILMINGTON TRUST, NATIONAL ASSOCIATION, AS JUNIOR DIP AGENT
To: EASTMAN KODAK COMPANY; PAKON, INC.
Reel/Frame 031157/0451 →
Intellectual Property Security Agreement (First Lien)
Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE
Reel/Frame 031158/0001 →
Intellectual Property Security Agreement (Second Lien)
Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.
To: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
Reel/Frame 031159/0001 →
Release of Security Interest
Apr 1, 2016
From: JPMORGAN CHASE BANK, N.A.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; AMIS HOLDINGS, INC.; AMI SEMICONDUCTOR, INC.; AMIS FOREIGN HOLDINGS INC.
Reel/Frame 038171/0254 →
Security Interest
Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
Release of Security Interest
May 6, 2016
From: JPMORGAN CHASE BANK, N.A. (ON ITS BEHALF AND ON BEHALF OF ITS PREDECESSOR IN INTEREST, CHASE MANHATTAN BANK)
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038632/0074 →
Release of Security Interest
May 6, 2016
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038631/0345 →
Corrective Assignment to Correct the Incorrect Patent Number 5859768 and to Recite Collateral Agent Role of Receiving Party in the Security Interest Previously Recorded on Reel 038620 Frame 0087. Assignor(S) Hereby Confirms the Security Interest.
Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
Release of Security Interest
Jul 22, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: QUALEX, INC.; EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC, INC.
Reel/Frame 050239/0001 →
Release of Security Interest
Jul 30, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; PFC, INC.; KODAK (NEAR EAST), INC.
Reel/Frame 049901/0001 →
Release of Security Interest
Jan 24, 2020
From: BARCLAYS BANK PLC
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST) INC.
Reel/Frame 052773/0001 →
Release of Security Interest in Patents Recorded at Reel 038620, Frame 0087
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →