Patent Assignment
Reel/Frame 026524/0051
Assignment of Assignor's Interest
Recorded: 2011-06-29
Pages: 4
Assignors
LEE, HYUNGMIN
Executed: 2011-06-15
CHI, HEEJO
Executed: 2011-06-15
PARK, YEONGIM
Executed: 2011-06-15
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Laser Hole and Method of Manufacture Thereof
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0227 →
Release of Security Interest
Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →
Corrective Assignment to Correct the Name of Receiving Party Data from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. Previously Recorded on Reel 38378 Frame 227. Assignor(S) Hereby Confirms the Change of Name.
Jun 13, 2025
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 071549/0923 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →